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Shockproof mechanism

A technology for buffer components and electronic devices, which is applied to the structural parts, electrical components, transportation and packaging of electrical equipment, etc., can solve the problems of short service life, unfavorable thinning, and easy to hinder the heat dissipation of electronic devices.

Inactive Publication Date: 2009-07-29
BENQ CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Although the above method can be used for shockproof, but because the service life of the general foam material is short, and it is easy to hinder the heat dissipation of the electronic device, in addition, the method of covering will inevitably increase its thickness, which is not conducive to achieving the purpose of thinning

Method used

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Experimental program
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Embodiment Construction

[0020] First refer to figure 1 This figure shows an exploded view of the shockproof mechanism of the present invention applied to an electronic device for a vehicle. As shown in the figure, an electronic device E is arranged inside a housing H, wherein the housing H is fixed to a vehicle. The electronic device E is, for example, a hard disk device for a vehicle or a CD-ROM, and can be installed in the vehicle. use.

[0021] Then refer to figure 1 , 2 , The shockproof mechanism of the present invention mainly includes a housing H, a first bracket B1, a second bracket B2, a plurality of first protruding rods P1, a plurality of second protruding rods P2, a plurality of first buffer elements R1, and a plurality of The second buffer element R2. As shown in the figure, the first protruding rod P1 and the second protruding rod P2 respectively protrude from the first side E1 and the second side E2 of the electronic device E, wherein the first side E1 is opposite to the second side E2, a...

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PUM

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Abstract

An anti-shock mechanism is suitable for an electronic device, and the electronic device is arranged in a vehicle. The anti-vibration mechanism includes a plurality of first protruding rods and a plurality of first buffer elements. The first protrusions respectively protrude from a first side of the electronic device, wherein the first side is approximately parallel to the traveling direction of the vehicle, and the first protrusions are approximately perpendicular to the first side. The first buffer elements respectively have a first concave hole, and the first protruding rods respectively pass through the first concave holes.

Description

Technical field [0001] The invention relates to a shockproof mechanism, in particular to a shockproof mechanism suitable for an electronic device for a vehicle. Background technique [0002] With the popularization of automotive electronic devices, the requirements for their performance and anti-shock (an-ti shock) are getting higher and higher. For example, in addition to the anti-vibration function, a hard disk device used in a car must also consider its heat dissipation to ensure stable use and increase its service life. [0003] Because vehicles are prone to vibration problems during travel (generally, the requirements for the vibration resistance of vehicles are between 0-4G and 5Hz-100Hz), the shock-proof design of traditional automotive electronic devices is usually covered by foam or other shock-absorbing materials. The exterior of the electronic device to achieve the effect of shockproof. [0004] Although the above method can be used to prevent shocks, the general foam ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/00B60R11/00
Inventor 卢龙祺张国华
Owner BENQ CORP