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Manufacturing method of a package substrate

A technology for packaging substrates and manufacturing methods, which is applied in the fields of printed circuit manufacturing, semiconductor/solid-state device manufacturing, printed circuits, etc., and can solve problems such as circuit density limitations

Inactive Publication Date: 2007-12-05
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, the formation of plated leads by existing techniques imposes limitations on circuit density
Also, an additional process is required to remove the plated lead after sputtering, and the plated lead residue can cause signal noise

Method used

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  • Manufacturing method of a package substrate
  • Manufacturing method of a package substrate
  • Manufacturing method of a package substrate

Examples

Experimental program
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Effect test

Embodiment Construction

[0018] Embodiments of a method of manufacturing a package substrate according to the present invention will be described in more detail below with reference to the accompanying drawings. In the description with reference to the drawings, those components that are the same or related are denoted by the same reference numerals regardless of the figure numbers, and repeated descriptions are omitted.

[0019] FIG. 2 is a flowchart illustrating a method of manufacturing a package substrate according to an embodiment of the present invention. FIG. 3 is a manufacturing diagram of a package substrate. Referring to FIG. 3 , a carrier 31 , a seed layer 32 , dry films 33 a , 33 b and 33 c , circuit patterns 34 , pads 35 , insulating layer 36 , via holes 37 , electroless plating 38 a , and filling plating 38 b are shown.

[0020] S21 of FIG. 2 is an operation of manufacturing an embedded pattern substrate in which pads 35 and circuit patterns 34 are buried in insulating layer 36 and seed...

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PUM

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Abstract

The present invention relates to a manufacturing method of a package substrate. This method is a method for manufacturing a package substrate used for mounting an electric element by connecting an electrode of the electric element to the bonding pad. The method includes (a) step of manufacturing a buried pattern substrate in which a circuit pattern and the bonding pad are buried in an insulating layer and a seed layer is laminated on the surface of the insulating layer; (b) a step of laminating a dry film on the seed layer and eliminating the seed layer and the dry film on the upper surface of the bonding pad; (c) a step of executing surface treatment on the bonding pad while using the remaining seed layer as a plating leading line; and (d) a step of eliminating the remaining seed layer and the dry film so that the circuit pattern can be exposed.

Description

[0001] Related Application Cross Reference [0002] This application claims the benefit of Korean Patent Application No. 2006-0049999 filed with the Korean Intellectual Property Office on June 2, 2006, the disclosure of which is hereby incorporated by reference in its entirety. technical field [0003] The invention relates to a method for manufacturing a package substrate. Background technique [0004] Recently, although the size of ICs has decreased, the number of leads has increased. In order to solve this problem, the use of package substrates such as BGA (Ball Grid Array) and CSP (Chip Scale Package) has become popular recently. In this package substrate, with the help of using solder balls, the substrate can be made with a higher density. Therefore, the package substrate can be effectively applied to mount semiconductor chips. [0005] In package substrates, in many cases, gold plating is applied to ball pads or bonding fingers etc. , a plated lead is formed on the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48H05K3/00H05K3/02
CPCH01L2924/0002H05K2203/1394H05K3/242H05K3/064H05K2203/0361H05K3/243H01L21/4846H05K3/108H05K2201/0376H05K3/427H01L23/49827H01L2924/00
Inventor 姜明杉柳济光朴正现金智恩郑会枸安镇庸
Owner SAMSUNG ELECTRO MECHANICS CO LTD