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Substrate material support unit and substrate material processing apparatus and method using same

A technology for supporting units and substrates, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problem that the back surface of the wafer cannot be cleaned or etched

Active Publication Date: 2008-07-02
SEMES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the rear surface of the wafer cannot be cleaned or etched

Method used

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  • Substrate material support unit and substrate material processing apparatus and method using same
  • Substrate material support unit and substrate material processing apparatus and method using same
  • Substrate material support unit and substrate material processing apparatus and method using same

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Embodiment Construction

[0024] The present invention will now be described more fully with reference to the accompanying drawings showing preferred embodiments of the invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Although embodiments of the present invention are described in connection with semiconductor manufacturing equipment configured to perform wet etching of semiconductor wafers, the present invention can be applied to all substrate processing equipment.

[0025] FIG. 1 is a perspective view of a substrate processing device according to an embodiment of the present invention, and FIG. 2 is an internal structural view of the substrate processing device shown in FIG. 1 .

[0026] Referring to FIGS. 1 and 2 , a substrate pr...

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Abstract

During processing, the substrate support unit supplies a vortex to the substrate to rotate and float the substrate from the clamping plate. Processing is performed while the substrate is spun and floated. Thus, the substrate is supported and rotated as it floats from the clamping plate in a contactless manner.

Description

[0001] Cross References to Related Applications [0002] This application claims priority from Korean Patent Application No. 2006-135283 filed on December 27, 2006, the entire contents of which are hereby incorporated by reference. technical field [0003] The present invention relates to apparatus and methods for treating substrates. More particularly, the present invention relates to a substrate support unit and an apparatus and method for treating a substrate using the substrate support unit. Background technique [0004] Typical substrate processing equipment is used to process substrates such as wafers for manufacturing semiconductor integrated circuit (IC) chips, glass substrates for manufacturing flat panel displays, and the like. In such a substrate processing apparatus, processing is performed while the substrate is loaded on the substrate support unit. In general, the substrate support unit supports the substrate during processing by means of mechanical clamps or...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H01L21/00
CPCH01L21/67051H01L21/6708H01L21/6838H01L21/687
Inventor 李泽烨金奉主
Owner SEMES CO LTD