Silicon slice etching equipment and method for controlling cavity top cover lifting

Abstract

The invention discloses silicon wafer etching equipment and a method to control the lift of an upper cover of a chamber. The device comprises an etching chamber which is provided with a mounting lined ring and an upper cover of the chamber. Three micro pressure switches are arranged between the mounting lined ring and the upper cover of the chamber to realize the control on the minimum falling limit of the upper cover of the chamber and improves the control logic of the lift of the upper cover of the chamber, which can control the ascending and descending of the upper cover of the chamber of the silicon wafer etching equipment accurately, safely and reliably and the accurate positioning when the cover is closed. The invention is mainly applied on semi-conductor silicon etching equipment and other similar equipment as well.

Description

Technical field [0001] The invention relates to a semiconductor silicon wafer processing equipment, in particular to a semiconductor silicon wafer etching equipment and a method for controlling the lifting of the upper cover of a chamber. Background technique [0002] In semiconductor processing technology, especially in etching, oxidation, chemical vapor deposition (CVD), etc., plasma-based semiconductor processing technology is usually used to process semiconductor silicon wafers into integrated circuit chips. In order to provide the best process environment for silicon wafer processing, the traditional plasma processing system is realized by controlling the air flow or plasma flow in the plasma vacuum chamber, which requires a vacuum chamber with higher sealing. When the parts inside the chamber, such as the electrostatic chuck, lining, thimble, etc., need to be disassembled or maintained, the upper cover of the chamber needs to be raised to open the chamber for disassembly an...

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