Thinning method of semiconductor chip

A semiconductor and chip technology, used in semiconductor/solid-state device manufacturing, electrical components, circuits, etc.

Active Publication Date: 2008-11-19
WUXI ZHONGWEI GAOKE ELECTRONICS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the thinning technology of integrated circuit wafers is mature, but there is no process method for chip-scale semiconductor devices to achieve thinning

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Embodiment 1: Thinning 100 chips with a thickness of 630 μm and a size of 6 mm×6 mm to 350 μm, the following process steps are adopted:

[0022] Take 100 chips with a thickness of 630 μm, and arrange the chip graphics face down tightly and neatly in the center of the thinning front protective film, with 10 chips in each row, a total of 10 rows to form a square, and place waste larger, Thickness is equivalent to the waste chip of chip, and waste chip surrounds a tight large square area; (Using the grinding method in the prior art to carry out thinning) set thinning thickness to be 350 μ m, begin to pass through the ceramics of emery wheel and adsorption small chip The suction cup rotates in the opposite direction, and the small chip is ground and thinned by means of a diamond wheel, and the ground silicon slag is taken away by pure water. The diamond wheel rotates at 800 rpm and drops at a speed of 30 μm / min. Ceramic suction cup Rotate at a speed of 18 revolutions per mi...

Embodiment 2

[0023] Embodiment 2: 72 chips with a thickness of 680 μm and a size of 5 mm×4 mm are thinned to 300 μm, and the following process steps are adopted:

[0024] Take 72 chips with a thickness of 680 μm, arrange the chips face down tightly and neatly in the center of the front protective film for thinning, 9 chips in each row, a total of 8 rows, forming a rectangle, and place waste larger, Waste chips with a thickness equivalent to the chip, the waste chips surround a tight large rectangular area; set the thinning thickness to 300 μm, start to rotate in the opposite direction through the diamond wheel and the ceramic suction cup that absorbs the small chip, and grind the small chip with the help of the diamond wheel Thinning, and the ground silicon slag is taken away by pure water. The diamond wheel rotates at a speed of 750 rpm and drops at a speed of 25 μm / min. The ceramic suction cup rotates at a speed of 18 rpm, and the pure water flow rate is 10L~15L; After thinning, you can ...

Embodiment 3

[0025] Embodiment 3: Two chips with a thickness of 550 μm and a size of 6 mm×5 mm are thinned to 280 μm, and the following process steps are adopted:

[0026] Take 2 chips with a thickness of 550 μm, arrange the chip pattern face down tightly and neatly on the front protective film for thinning, and arrange them in a row to form a rectangle. Quite a waste chip, the waste chip surrounds a tight large rectangular area; set the thinning thickness to 280 μm, start to rotate in the opposite direction through the diamond wheel and the ceramic suction cup that absorbs the small chip, and use the diamond wheel to grind the small chip thinner , and the ground silicon slag is taken away by pure water, the diamond wheel rotates at 850 rpm, and the speed decreases every 25 μm / min, the ceramic sucker rotates at 18 rpm, and the pure water flow rate is 10L to 15L per minute ;After thinning, wipe the thinned chip with dust-free fiber paper. After the dust-free fiber paper is dirty, replace it...

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PUM

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Abstract

The invention discloses a semiconductor chip thickness reduction method and in particular relates to thickness reduction technique on semiconductor chips, etc., belonging to the integrated circuit manufacturing technical field. The semiconductor chip thickness reduction method is characterized in that semiconductor apparatuses are arranged in lines and rows, with the pictured sides facing downward; the target sides semiconductor apparatuses adhere to a protecting film, developing into a square or a rectangle; a sheet object matching with the semiconductors in area and thickness is arranged at the periphery of the square or the rectangle and is made into a square or a rectangle so that the semiconductor at the middle can be even in bearing stress during the thickness reduction process; the reduction amount is determined and the semiconductors are reduced in thickness through grinding; after the thickness reduction process, post treatment is done to the thinned chips; finally, desirable chips are turned out. The method requires no change to current thickness reduction equipment and fixtures; the thinned chips are the same in thickness and are in consistency with the thickness of the wafer; the yield is high and the thinned chips have no defects and cracks at the brims.

Description

technical field [0001] The invention relates to a method for thinning a semiconductor chip, in particular to a thinning process for devices such as semiconductor chips, and belongs to the technical field of integrated circuit manufacturing. Background technique [0002] At present, the thinning of devices such as semiconductor chips is the thinning of the entire wafer. Usually, the excess thickness is subtracted by grinding, lapping, chemical mechanical polishing, dry polishing, etc. on the back of the wafer. To reduce the height of the package; remove the back oxide or diffusion layer to eliminate parasitic junctions, reduce thermal resistance, improve ohmic contact and reduce series resistance during back metallization. Thinning to a certain thickness will also help improve chip flexural performance. Grinding method, lapping method, chemical mechanical polishing, dry polishing and other methods all use emery wheels or abrasives or corrosive reagents and combinations to rem...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00H01L21/30H01L21/304
Inventor 章文丁荣峥吴刚
Owner WUXI ZHONGWEI GAOKE ELECTRONICS
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