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Phosphates adhesive and preparation method thereof

A phosphate and adhesive technology, used in adhesives, inorganic adhesives, etc., can solve the problems of high temperature resistance and water resistance decline of phosphate adhesives, and achieve the effect of small thermal expansion coefficient, improved adhesion and good water resistance.

Inactive Publication Date: 2011-09-21
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to solve the problem that the existing phosphate adhesives are cured at room temperature, and the high temperature resistance and water resistance are reduced, and to provide a phosphate adhesive and a preparation method thereof

Method used

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  • Phosphates adhesive and preparation method thereof

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specific Embodiment approach 1

[0009] Embodiment 1: The phosphate adhesive in this embodiment consists of 100 parts by mass of phosphoric acid solution, 20 to 50 parts of aluminum hydroxide powder, 50 to 100 parts of alumina powder, and 1 to 20 parts of zirconia powder It is made with 1-20 parts of zinc oxide powder or aluminum nitride powder; the mass concentration of phosphoric acid solution is 80%-90%.

specific Embodiment approach 2

[0010] Specific embodiment two: the difference between this embodiment and specific embodiment one is that the phosphate adhesive consists of 100 parts by mass of phosphoric acid solution, 30-40 parts of aluminum hydroxide powder, 60-90 parts of aluminum oxide powder, It is prepared by 4-15 parts of zirconia powder and 4-15 parts of zinc oxide powder or aluminum nitride powder. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0011] Specific embodiment three: the difference between this embodiment and specific embodiment one is that the phosphate adhesive consists of 100 parts of phosphoric acid solution, 35 parts of aluminum hydroxide powder, 75 parts of aluminum oxide powder, and 10 parts of oxidized Zirconium powder is made with 10 parts of zinc oxide powder or aluminum nitride powder. Others are the same as in the first embodiment.

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Abstract

The present invention discloses a phosphate adhesive and a preparation method thereof, which relate to an adhesive and a preparation method thereof. The present invention resolves the problem that the curing and heat-resisting capabilities of the prior phosphate adhesive are impaired under the room temperature. The phosphate adhesive of the present invention is prepared with phosphoric acid solution, aluminum hydroxide powder, aluminum oxide powder, zirconium oxide powder and zinc oxide powder or aluminum nitride powder. The preparation method includes the following steps: (1) the materials are weighed out; (2) the phosphoric acid solution is mixed with the aluminum hydroxide powder so that aluminum dihydrogen phosphate matrix resin can be made; (3) the aluminum oxide powder, the zirconium oxide powder and the zinc oxide powder or the aluminum nitride powder are mixed together so that curing agent is prepared; (4) the aluminum dihydrogen phosphate matrix resin and the curing agent aremixed together, and after being cured under the room temperature, the phosphate adhesive is prepared. The phosphate adhesive of the present invention can be cured under the room temperature and can resist a temperature up to 1580 DEG C, moreover, the water-resisting property of the phosphate adhesive of the present invention is good, and after the phosphate adhesive is soaked in tap water under the room temperature for 100 days, the reduction rate of the adhering strength of the phosphate adhesive is less than 10 percent.

Description

technical field [0001] The invention relates to an adhesive and a preparation method thereof. Background technique [0002] With the advancement of industrial technology, people have put forward higher and higher requirements for the heat-resistant temperature of materials, which requires the use of high-temperature-resistant adhesives for bonding; adhesives with high-temperature resistance above 1000 °C mainly include phosphoric acid-copper oxide adhesive system, Silicate adhesive systems and phosphate adhesive systems. However, phosphoric acid-copper oxide adhesive systems usually require heat curing and are difficult to cure at room temperature. Although silicate adhesives can be cured at room temperature, their shear strength is relatively low, and their water resistance is poor, which cannot meet the mechanical performance requirements of bonded parts. The phosphate adhesive system has high shear strength, low curing temperature, excellent heat resistance, good water ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J1/00
Inventor 王超拉普阔·康斯坦金陈泽明王勃
Owner INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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