Interposing frame and retaining plate component

Abstract

The invention provides a plug frame and a baffle component. The implementation manner of the invention is as follows: the baffle component is arranged in a slot; under the condition that a circuit board is inserted in the slot where the baffle component is arranged, the projected area of a first baffle in the direction in which the circuit board is inserted in the slot is larger than or equal to the area of an insertion opening so that the insertion opening of the slot can be covered, thereby preventing the air stream in the plug frame from leaking to the external part; the projected area of a second baffle arranged inside the slot in the direction from an air inlet to an air outlet is larger than or equal to the area of the air inlet, so that the air stream from the air inlet can be prevented from passing through the slot, thereby greatly reducing the air stream flow in the hollow slot, meeting the requirement of the air stream flow of other non-hollow slots, and avoiding air stream short circuit. The baffle component can prevent the air stream from leaking outside the plug frame, greatly reduce the flow passing through the hollow slot, and meet the flow requirements of other non-hollow slots, thereby avoiding air stream short circuit and improving the radiating effect of the circuit board inserted in the plug frame.

Description

technical field [0001] The invention relates to heat dissipation protection technology, in particular to a subframe including a baffle assembly and a baffle assembly. Background technique [0002] The socket frame for inserting the circuit board generally includes a plurality of slots, and each slot has an insertion port for inserting a circuit board such as a single board. [0003] figure 1 It is a structural schematic diagram of an existing subframe. Such as figure 1 As shown, the subrack includes four slots 10 , and each slot 10 has an insertion port 101 for inserting a single board 11 . Such as figure 1 Among the four slots 10 shown, a single board 11 placed horizontally is respectively inserted into the top three slots 10 . [0004] On the side of the subframe perpendicular to the plane where the insertion opening 101 of the slot 10 is located, there is a cooling device 12 that discharges airflow for cooling the single board 11 into each slot 10 . Wherein, the slo...

AI Technical Summary

Problems solved by technology

[0007] Moreover, most of the airflow flowing through the slot 10 where no single board 11 is inserted may also flow from the insertion port 101 of the slot 10 to the outside of the subframe.

[0008] It can be seen that there will be a short circuit of airflow in the existing subrack, and the airflow may be lost to the outside of the subrack, making the heat dissipation effect on the circuit board lower

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