Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Plastering device and plastering method thereof

A technology of attachment and anisotropic conduction, which is applied in the attachment device and its attachment field, can solve the problems of long attachment device time-consuming, great difference in the length of the attachment area, and a large number of segments, so as to reduce the attachment time , Improve the demand for diverse attachments, and the effect of wide elastic space

Inactive Publication Date: 2009-04-01
INNOLUX CORP
View PDF3 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the attachment area on the substrate is continuous and the length is long, the longer attachment device will take time
Therefore, if there are many attachment areas on a substrate, and the lengths of each attachment area are very different, the existing attachment devices cannot perform the attachment action efficiently.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Plastering device and plastering method thereof
  • Plastering device and plastering method thereof
  • Plastering device and plastering method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] The present invention specially designs an attaching device, which has a movable attaching mechanism for attaching the long anisotropic conductive material and the short anisotropic conductive material on the substrate correspondingly. Moreover, the attachment device has two indenters, one is a long indenter and the other is a short indenter. Therefore, the attachment device of the present invention provides a wider elastic space when attaching anisotropic conductive materials on the substrate, effectively The attaching time can be reduced as much as possible, and the demand for diverse attachment of anisotropic conductive materials on the substrate can be increased. The long sticking process and the short sticking process of the sticking device of the present invention will be described as follows with the drawings of preferred embodiments, but the technology of the present invention is not limited thereto.

[0035] Please refer to FIG. 1 to FIG. 5 at the same time, wh...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an attaching device and an attaching method; wherein, the attaching device comprises a platform used for arranging a substrate, an attaching mechanism used for attaching anisotropic conductive materials on the substrate, a long press and a short press used for exerting external forces on the substrate which is used for attaching the anisotropic conductive materials; the attaching method comprises the steps as follows: the substrate is arranged on the platform; the attaching mechanism is moved so as to attach the anisotropic conductive material to the substrate; the long press and the short press are used to exert the external force on the substrate which is used for attaching the anisotropic conductive material on the substrate. The attaching device and the attaching method provide wider elastic space when the anisotropic conductive material is attached to the substrate, and effectively reduce the attaching time compared with the traditional long-attaching device and the short-attaching device; furthermore, the attaching device combines the functions of the traditional long-attaching and short-attaching devices, and can improve the requirement of diversified attachment of anisotropic material on the substrate.

Description

technical field [0001] The present invention relates to an attaching device and an attaching method thereof, and in particular relates to an attaching device and an attaching device for attaching an anisotropic conductive material on a substrate by moving a long indenter and a short indenter correspondingly. its attachment method. Background technique [0002] At present, the liquid crystal display industry adopts the chip on glass (COG) process to attach the chip to the glass substrate or the tape carrier packing (Tap Carrier Packing, TCP) and the film core packing (Chip on Film, COF). Carried on the circuit board of the tape or film, and then electrically connected to the substrate by the circuit board of the tape or film. Taking Tap Carrier Packing (TCP) and Chip on Film (COF) as an example, the chip is carried on the circuit board of tape or film, and then the anisotropic conductive material with conductive particles ( After the anisotropic conductive film (ACF) is att...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/13G02F1/1345H05B33/10
Inventor 谢仲豪
Owner INNOLUX CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com