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Plastering device and plastering method thereof

An attachment and anisotropic conductive technology, which is applied to the attachment device and its attachment field, can solve the problems of great difference in the length of the attachment area, time-consuming for long attachment devices, and a large number of segments, so as to improve the diversity of attachments. The effect of attaching demand, reducing attaching time, and wide elastic space

Inactive Publication Date: 2013-06-19
INNOLUX CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the attachment area on the substrate is continuous and the length is long, the longer attachment device will take time
Therefore, if there are many attachment areas on a substrate, and the lengths of each attachment area are very different, the existing attachment devices cannot perform the attachment action efficiently.

Method used

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  • Plastering device and plastering method thereof
  • Plastering device and plastering method thereof
  • Plastering device and plastering method thereof

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Embodiment Construction

[0034] The present invention specially designs an attaching device, which has a movable attaching mechanism for attaching the long anisotropic conductive material and the short anisotropic conductive material on the substrate correspondingly. Moreover, the attachment device has two indenters, one is a long indenter and the other is a short indenter. Therefore, the attachment device of the present invention provides a wider elastic space when attaching anisotropic conductive materials on the substrate, effectively The attaching time can be reduced as much as possible, and the demand for diverse attachment of anisotropic conductive materials on the substrate can be increased. The long sticking process and the short sticking process of the sticking device of the present invention will be described as follows with the drawings of preferred embodiments, but the technology of the present invention is not limited thereto.

[0035] Please also refer to Figure 1 to Figure 5 , which sh...

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Abstract

The invention discloses an attaching device and an attaching method; wherein, the attaching device comprises a platform used for arranging a substrate, an attaching mechanism used for attaching anisotropic conductive materials on the substrate, a long press and a short press used for exerting external forces on the substrate which is used for attaching the anisotropic conductive materials; the attaching method comprises the steps as follows: the substrate is arranged on the platform; the attaching mechanism is moved so as to attach the anisotropic conductive material to the substrate; the long press and the short press are used to exert the external force on the substrate which is used for attaching the anisotropic conductive material on the substrate. The attaching device and the attaching method provide wider elastic space when the anisotropic conductive material is attached to the substrate, and effectively reduce the attaching time compared with the traditional long-attaching device and the short-attaching device; furthermore, the attaching device combines the functions of the traditional long-attaching and short-attaching devices, and can improve the requirement of diversified attachment of anisotropic material on the substrate.

Description

technical field [0001] The present invention relates to an attaching device and an attaching method thereof, and in particular relates to an attaching device and an attaching device for attaching an anisotropic conductive material on a substrate by moving a long indenter and a short indenter correspondingly. its attachment method. Background technique [0002] At present, the liquid crystal display industry adopts the chip on glass (COG) process to attach the chip to the glass substrate or the tape carrier packing (Tap Carrier Packing, TCP) and the film core packing (Chip on Film, COF). Carried on the circuit board of the tape or film, and then electrically connected to the substrate by the circuit board of the tape or film. Taking Tap Carrier Packing (TCP) and Chip on Film (COF) as an example, the chip is carried on the circuit board of tape or film, and then the anisotropic conductive material with conductive particles ( After the anisotropic conductive film (ACF) is att...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/13G02F1/1345H05B33/10
Inventor 谢仲豪
Owner INNOLUX CORP
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