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Overlay accuracy control method and device

A technology of overlay accuracy and control method, which is applied in the field of photolithography technology, and can solve the problems of increasing the control complexity of the APC system and increasing the storage capacity of the APC system.

Active Publication Date: 2011-12-07
SEMICON MFG INT (SHANGHAI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If more exposure machines are used, the number of overlay precision control processes will increase, which is equal to the number of exposure machines of company (factory) A multiplied by the number of exposure machines of company (factory) B, overlay The increase in the number of precision control processes not only increases the storage capacity of the APC system, but also increases the complexity of the APC system control

Method used

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  • Overlay accuracy control method and device

Examples

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no. 1 example

[0053] figure 2 It is a flow chart of the control method of overlay accuracy in this embodiment. In this embodiment, the photolithography process of the front and rear layers is completed across the factory area, that is, the photolithography process of the front and rear layers is completed by different factory areas of the same company. Different exposure machines can be used in the factory area, or the same exposure machine can be used.

[0054] Please refer to figure 2 , Company A’s factory area Aa uses the exposure machine A1 to perform the front-layer photolithography process on the wafer, and then, the company A’s factory area Ab uses the exposure machine A2 to perform the current layer photolithography process on the wafer.

[0055] In step S21, the factory area Ab first needs to obtain the photolithography process conditions of the previous layer photolithography process from the factory area Aa before using the exposure machine A2 to perform the current layer phot...

no. 2 example

[0078] Figure 4 It is a flow chart of the control method of overlay accuracy in this embodiment. In this embodiment, the lithography process of the front and rear layers is completed across companies, that is, the lithography process of the front and rear layers is completed by different companies, and different companies can use Different exposure machines can also use the same exposure machine.

[0079] Please refer to Figure 4 , company A uses exposure machine A2 to perform the front-layer lithography process on the wafer, and then company B uses exposure machine B1 to perform the current-layer lithography process on the wafer.

[0080] In step S41, before company B uses the exposure machine B1 to perform the current layer photolithography process, it first needs to obtain the photolithography process conditions of the previous layer photolithography process from company A. That is to say, after company A uses the exposure machine A2 to complete the lithography process ...

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Abstract

A control method and device for overlay accuracy, the control method for overlay accuracy includes: obtaining the lithography process conditions of the front layer lithography process; calculating the error introduced by the process according to the lithography process conditions of the front layer lithography process , and calculate the process compensation value of the current layer exposure machine according to the lithography process conditions of the previous layer lithography process and the error introduced by the calculated process; according to the calculated process compensation value of the current layer exposure machine, control the current layer The exposure machine performs the photolithography process. The method and device for controlling the overlay accuracy can reduce the position alignment error between the layers of the wafer and the photolithography pattern of the layer, so as to precisely control the overlay accuracy.

Description

technical field [0001] The invention relates to a photolithography process, in particular to a control method and device for overlay precision. Background technique [0002] Photolithography is a process of transferring mask patterns to wafers through a series of steps such as alignment and exposure. In the manufacturing process of semiconductor chips, the entire manufacturing process is usually completed through a multi-layer photolithography process. How to control It is a crucial step in the multi-layer lithography process when the lithographic pattern of the first layer is aligned with the lithographic pattern of the previous layer (pattern on the wafer) to meet the requirements of overlay accuracy. The overlay accuracy is Refers to the alignment error between the wafer layer and the photolithographic pattern of the layer. [0003] At present, most manufacturing companies use Advanced Process Control (APC, Advanced Process Control) systems for photolithography to meet t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
Inventor 杨晓松
Owner SEMICON MFG INT (SHANGHAI) CORP