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Cooler

A cooler, cooling fluid technology, applied in cooling/ventilation/heating transformation, electric solid devices, semiconductor devices, etc., can solve the problem of homogenization without any research, inability to uniformly cool the object to be cooled, and cooling fluid behavior without Research and other issues to achieve the effect of uniform cooling

Inactive Publication Date: 2009-06-17
TOYOTA JIDOSHA KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this publication, no study is made on the homogenization of the droplets on the surface of the heat transfer wall to which the cooling fluid is sprayed
That is, although the amount of spraying is controlled, the behavior of the cooling fluid sprayed on the heat transfer member has not been studied.
After the cooling fluid is sprayed, if the state of the liquid droplets on the surface of the heat transfer part is not uniform, the object to be cooled cannot be cooled uniformly

Method used

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Experimental program
Comparison scheme
Effect test

no. 1 approach

[0034] refer to Figure 1 to Figure 8 The cooler in the first embodiment of the present invention will be described.

[0035] figure 1 It is a schematic side view of the cooler in this embodiment. The cooler in this embodiment is a cooler that cools by spraying a cooling fluid. The cooler in this embodiment includes a heat transfer member 1 . The heat transfer member 1 is formed in a flat plate shape.

[0036] On the surface of the heat transfer member 1, a heat generating body 12 as a body to be cooled is arranged. The heat generating body 12 is bonded to the main surface of the heat transfer member 1 . In the present embodiment, the heating element 12 is arranged at the center of the main surface of the heat transfer member 1 .

[0037] The cooler in this embodiment includes a sprayer 11 . The atomizer 11 is arranged to face the main surface of the heat transfer member 1 on the side opposite to the side where the heating element 12 is arranged. A nebulizer 11 is arra...

no. 2 approach

[0066] refer to Figure 9 A cooler in a second embodiment of the present invention will be described. The configuration of the first flow path and the second flow path of the heat transfer member of the cooler in this embodiment is different from that of the first embodiment.

[0067] Figure 9 It is a schematic plan view of the heat transfer member in this embodiment. The heat transfer member 2 is formed in a flat plate shape. The heat transfer member 2 is formed to have a substantially circular planar shape.

[0068] The heat transfer member 2 in this embodiment has the 1st groove 2a which is a 1st flow path, and the 2nd groove 2b which is a 2nd flow path. The first groove 2a and the second groove 2b are formed on the face to which the cooling fluid is sprayed. The first groove 2a and the second groove 2b are formed to cross each other. The first groove 2a and the second groove 2b communicate with each other.

[0069] The heat generating body 12 serving as the object ...

no. 3 approach

[0075] refer to Figure 10 and Figure 11 A cooler in a third embodiment of the present invention will be described. In this embodiment, the shape of the heat transfer member is different from that of the first embodiment.

[0076] Figure 10 It is a schematic side view of the 1st cooler in this embodiment. The first cooler in this embodiment includes a heat transfer member 3 . The surface of the heat transfer member 3 on which the first groove and the second groove are formed is formed in a convex shape. The heat transfer member 3 is formed to have a substantially circular planar shape.

[0077] The heat transfer member 3 is formed such that the height of the surface on which the cooling fluid 21 is sprayed becomes lower from the central portion toward the outer peripheral portion. The surface of the heat transfer member 3 is inclined. The heat transfer member 3 is formed to be thickest at a portion facing the nebulizer 11 and becomes thinner toward the outer periphery...

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PUM

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Abstract

A cooler is provided with a heat transmitting member (1) having a surface whereupon a cooling fluid is to be sprayed. The heat transmitting member (1) includes a first groove (1a) formed on the surface, and a second groove (1b) which is formed on the surface and intersects with the first groove (1a).

Description

technical field [0001] The present invention relates to coolers. Background technique [0002] In addition to coolers that perform heat exchange by making cooling fluid flow inside and thereby cool the object to be cooled arranged on the surface of the cooler, there are also coolers that arrange the object to be cooled on the heat transfer member and pass it to the heat transfer member. A cooler that sprays a cooling fluid for cooling. [0003] Japanese Patent Application Laid-Open No. 3-30457 discloses a method for cooling a semiconductor device in which a predetermined liquid is supplied to a heat generating portion of the semiconductor device and vaporized, and the heat generating portion is cooled by the latent heat of vaporization. According to the semiconductor device cooling method, the cooling efficiency and the reliability of the semiconductor device can be improved, the cooling structure can be simplified and downsized, and corrosion and contamination caused by th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/427H05K7/20
CPCH01L23/427H01L2924/0002F28F3/048F28F13/187F28F2215/10H01L2924/00
Inventor 吉田忠史横井丰长田裕司
Owner TOYOTA JIDOSHA KK