Probe tower and manufacturing method thereof

A probe and probe hole technology, applied in the field of probe towers, can solve problems such as easily broken needles

Active Publication Date: 2012-07-18
KING YUAN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In order to solve the above problems, the present invention discloses a probe tower with a characteristic impedance using a body made of different materials. The probe is fixed on the probe tower, instead of welding the test probe to the PCB board first, and then putting the test probe needle into the test probe sleeve to solve the problem of the test probe sleeve in the known technology. When the damage needs to be replaced, the test probe sleeve must be dissoldered before the test probe sleeve can be removed for replacement.

Method used

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  • Probe tower and manufacturing method thereof
  • Probe tower and manufacturing method thereof
  • Probe tower and manufacturing method thereof

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Embodiment Construction

[0048] Since the present invention discloses a wafer test of integrated circuit components in a back-end semiconductor process, the basic manufacturing and semiconductor testing principles of the probe towers used have been understood by those with ordinary knowledge in the relevant technical field, so the following Description, no complete description. At the same time, the diagrams compared below are schematic structural representations related to the features of the present invention, and are not and need not be completely drawn based on actual dimensions, and are described first.

[0049] Please refer to Figure 1 to Figure 3 , according to the first preferred embodiment provided by the present invention, is a probe tower 10 for wafer testing. The probe tower 10 includes a circular body 11, multiple groups of probe holes 14, multiple groups of test probes 15, and multiple groups of grounding holes 16 ( figure 1The middle ground hole 16 should not pass through the Pogo to...

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Abstract

The invention relates to a probe tower and a manufacturing method thereof. The probe tower is applied to wafer test and comprises a round body, multi clusters of probe holes, multi clusters of test probes, multi clusters of grounding holes and multi clusters of spacer rings; the round body is provided with an LCD test zone and an I / O test zone, a body upper seat and a body lower seat; the multi clusters of probe holes are arranged in the LCD test zone and I / O test zone, and penetrate through the body upper seat and the body lower seat vertically; the multi clusters of test probes are arrangedin the probe holes; the multi clusters of grounding holes are arranged in the I / O test zone, multi clusters of grounding probes are closely inlaid into the clusters of grounding holes of the body upper seat or the body lower seat, and in electric conduction with the round body; the multi clusters of spacer rings are insolating materials, arranged at the top part of the probe holes for fixing the test probes on the round body to electrically isolate the probe holes from the round body; in addition, the round body is of glass fiber material in LCD test zone and aluminum alloy material in I / O test zone, and the test probes in I / O test zone adopts non-coaxial design with the air as medium, thus the probe tower has characteristic impedance of specific default value.

Description

technical field [0001] The invention relates to a probe tower, in particular to a probe tower that provides non-coaxial test probes with air as the medium in the I / O area, and a probe tower that has better impedance matching so that the test waveform is not distorted. needle tower. Background technique [0002] At present, the test probes on the probe tower are respectively arranged in the I / O area and the LCD area of ​​the probe tower. The test probes used in the I / O area are thinner, and the test probes used in the LCD area are thicker. And at present, the test probes in the probe tower I / O area and LCD area are fixed. The part of the test probe sleeve is welded on the PCB board first, and then the test probe needle is put into the test probe sleeve. In the tube, and use the wires on the PCB board to connect the ground of the I / O area and the LCD area to each other, so as to eliminate noise and leakage current. The prior art US Pat. No. 6,114,869, US Pat. No. 6,166,553, ...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): G01R1/067G01R1/073G01R31/28
Inventor温进光陈圣杰
OwnerKING YUAN ELECTRONICS