Manufacturing method of golden fingers
A production method and technology of gold fingers, which are applied in printed circuit manufacturing, printed circuits, electrical components, etc., can solve the problems of insufficient space on printed circuit boards and fake gold fingers, avoid burning or de-gold, improve quality, The effect of delaying the current
Active Publication Date: 2011-04-27
新方正控股发展有限责任公司 +1
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Problems solved by technology
[0007] The technical problem to be solved by the present invention is to provide a method for making a "fake gold finger" for the above-mentioned shortcomings in the prior art. "Problems, and can effectively avoid the adverse effects of instantaneous contact current on the "golden finger" during electroplating
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[0031] According to the present invention, a method for making a "golden finger" is provided, comprising the following steps:
[0032] 1) Form one or more "gold finger" substrates perpendicular to the side of the circuit board, the "gold finger" substrate has a first end connected to the circuit board and a second end connected to the plating lead Two ends; form a "false gold finger" on the electroplating lead, and the "false gold finger" extends in a direction away from the "gold finger" substrate so that the "false gold finger" is ahead of the subsequent electroplating The "gold finger" substrate is exposed to the electroplating current, and the "false gold finger" has an initial end connected to the electroplating lead and an opposite free end;
[0033] 2) Electroplating the "gold finger" substrate and the "false gold finger";
[0034] 3) Remove the plating leads and "fake gold fingers".
[0035] Preferably, in each embodiment of the present invention, the "fake gold fing...
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The invention provides a manufacturing method of golden fingers, which comprises the following steps: (1) forming one or more golden finger substrates on and perpendicular to a side edge of a circuit board, wherein each golden finger substrate is provided with a first end connected to the circuit board and a second end connected with an electroplating lead; and forming false golden fingers on the electroplating lead, wherein the false golden fingers extend along a direction far away from the golden finger substrates so that the false golden fingers are in contact with electroplating current before the golden finger substrates during subsequent electroplating, each false golden finger is provided with a beginning end and an opposite free end, and the beginning end is connected with the electroplating lead; (2) electroplating the golden finger substrates and the false golden fingers; and (3) removing the electroplating lead and the false golden fingers. The method can thoroughly solve the problem that the false golden fingers can not be arranged due to lack of space of a printed circuit board, and can effectively avoid the adverse effects generated by momentary contact current on the golden fingers during electroplating.
Description
technical field [0001] The invention belongs to the technical field of printed circuit boards. In particular, it relates to a manufacturing method of a "golden finger" on a printed circuit board. Background technique [0002] "Gold Finger" (Gold Finger) is used for computer graphics cards, memory sticks, USB interfaces and other related equipment in contact with other substrates. It has good wear resistance and low contact resistance, and can meet multiple times (about 500 times) plugging requirements. In the production process of printed circuit boards, all card boards need to be plated with "golden fingers". [0003] In the process of electroplating "gold fingers", when the "gold fingers" are in contact with the electroplating solution, due to the instantaneous contact current of the "gold fingers", it is very easy to cause the instantaneous current to be too large and cause quality problems such as burning and degolding of the gold fingers . At present, the way to imp...
Claims
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Inventor 江民权张彬
Owner 新方正控股发展有限责任公司