Check patentability & draft patents in minutes with Patsnap Eureka AI!

LED package

A technology of LED packaging and LED chips, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as easy degradation of resin

Active Publication Date: 2011-08-03
SAMSUNG ELECTRONICS CO LTD
View PDF7 Cites 16 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Meanwhile, the resin portion sealing the LED chip is easily deteriorated due to the increase of light and heat radiated from the LED chip

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • LED package
  • LED package
  • LED package

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0024] First, the first embodiment will be described.

[0025] figure 1 is a plan view of the LED package according to the present embodiment;

[0026] figure 2 is along figure 1 A cross-sectional view taken along line A-A' shown in .

[0027] Such as figure 1 and 2 As shown, the LED package 1 according to this embodiment includes six lead frames 11 to 16 . The lead frames 11 to 16 each have a flat shape, and are arranged flush with and separated from each other. The lead frames 11 to 16 are made of the same conductive material. For example, each of the lead frames 11 to 16 is a copper plate with silver-plated layers formed on the upper and lower surfaces. Incidentally, no silver plating layer was formed on the edge surfaces of the lead frames 11 to 16, and the copper plates were exposed.

[0028] Three LED chips 21R, 21G, and 21B are disposed over the lead f...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention relates to an LED package. According to one embodiment, the LED package includes 2n (n is an integer of 2 or more) lead frames, n LED chips and a resin body. The 2n lead frames are arranged to be apart from each other. The n LED chips are provided above the lead frames. Each of the n LED chips has one terminal connected to each of n lead frames of the 2n lead frames and another terminal connected to each of lead frames of the 2n lead frames other than the n lead frames. The resin body covers the 2n lead frames and the n LED chips.

Description

[0001] Cross References to Related Applications [0002] This application is based on and claims priority from prior Japanese Patent Application No. 2010-019781 filed on January 29, 2010 and Prior Japanese Patent Application No. 2010-143663 filed on June 24, 2010, incorporated by reference Its entire contents are incorporated herein. technical field [0003] Embodiments described herein relate generally to LED packages. Background technique [0004] Conventionally, an LED package mounted with an LED chip is configured in such a manner as to control light distribution characteristics and improve light extraction efficiency from the LED package. Specifically, the LED package has a cup-shaped housing made of white resin. Then, LED chips are mounted on the bottom surface of the case. The inside of the case is filled with a transparent resin to bury the LED chip therein. In many cases, the housing is formed of thermoplastic polyamide resin (see, for example, Patent Applicatio...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L33/48H01L25/16H01L33/56H01L25/075H01L33/60H01L33/62
CPCH01L2224/32245H01L2224/97H01L2224/48091H01L24/97H01L2224/73265H01L2224/48247H01L2224/49113H01L2224/32013H01L2924/12041H01L2224/48465H01L33/48H01L2924/351H01L2924/12035H01L2224/48257H01L24/73H01L2924/00014H01L2924/00H01L2924/00012
Inventor 江越秀徳田村一博押尾博明清水聪竹内辉雄井上一裕松本岩夫
Owner SAMSUNG ELECTRONICS CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com