Multi-coating technology

A process and coating furnace technology, which is applied in the field of solar cell manufacturing, can solve the problems that the refractive index and thickness of silicon nitride film cannot be matched to the optimal value at the same time, the passivation effect cannot be optimal, and the loss of cell efficiency, etc., to improve Passivation effect, reduce reflectivity, improve conversion rate effect

Inactive Publication Date: 2014-04-02
ZHEJIANG BEYONDSUN PV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Traditional anti-reflection film on the surface of solar cells uses silicon nitride thin film. The characteristics of silicon nitride as the surface anti-reflection film are that the process is simple, easy to industrialized production, and the cost is low, but the disadvantages are also obvious: silicon nitride as the surface anti-reflection film The anti-reflection film is on the battery and components, and the refractive index and thickness of the silicon nitride film cannot be matched to the optimal value at the same time, resulting in a certain packaging loss at the component end after packaging; at the same time, due to the main consideration of the optical properties of the silicon nitride film, Therefore, the best passivation effect cannot be achieved, resulting in a certain degree of loss of cell efficiency; and the design of the traditional silicon nitride anti-reflection coating has a large gap in the design of the refractive index and thickness from the perspective of the battery and the module. The difference, so a new anti-reflection coating design is needed to reduce the loss caused by this difference

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] The multi-layer coating process includes the following steps:

[0031] A. Feeding, place the silicon wafer in the diffusion furnace;

[0032] B. Heat the silicon wafer to 800°C, and at the same time fill it with a mixture of oxygen and nitrogen at a ratio of 2:15 to oxidize the surface of the silicon wafer;

[0033] C. The continuous oxidation time is 12 minutes. After the oxide layer reaches 7nm, stop inflating and make a semi-finished product;

[0034] D. Take out the primary semi-finished product from the diffusion furnace, and cool the primary semi-finished product to room temperature;

[0035] E. Place the cooled primary semi-finished product in the graphite boat, transport the graphite boat into the coating furnace tube and connect the electrode hole of the graphite boat with the electrode rod in the coating furnace tube;

[0036] F. Vacuumize the coating furnace tube to below 30mbar, close all valves, and keep the pressure in the tube for 30s. During this proce...

Embodiment 2

[0045] The multi-layer coating process includes the following steps:

[0046] A. Feeding, place the silicon wafer in the diffusion furnace;

[0047] B. Heat the silicon wafer to 780°C, and at the same time fill it with a mixture of oxygen and nitrogen at a ratio of 1:15 to oxidize the surface of the silicon wafer;

[0048] C. The continuous oxidation time is 10 minutes. After the oxide layer reaches 5nm, stop inflating and make a semi-finished product;

[0049] D. Take out the primary semi-finished product from the diffusion furnace, and cool the primary semi-finished product to 100°C;

[0050] E. Place the cooled primary semi-finished product in the graphite boat, transport the graphite boat into the coating furnace tube and connect the electrode hole of the graphite boat with the electrode rod in the coating furnace tube;

[0051] F. Vacuumize the coating furnace tube to below 25mbar, close all valves, and keep the pressure in the tube for 30s. During this process, the tem...

Embodiment 3

[0059] The multi-layer coating process includes the following steps:

[0060] A. Feeding, place the silicon wafer in the diffusion furnace;

[0061] B. Heat the silicon wafer to 800°C, and at the same time fill it with a mixture of oxygen and nitrogen at a ratio of 3:15 to oxidize the surface of the silicon wafer;

[0062] C. The continuous oxidation time is 15 minutes. After the oxide layer reaches 10nm, stop the inflation and make a semi-finished product;

[0063] D. Take out the primary semi-finished product from the diffusion furnace, and cool the primary semi-finished product to room temperature;

[0064] E. Place the cooled primary semi-finished product in the graphite boat, transport the graphite boat into the coating furnace tube and connect the electrode hole of the graphite boat with the electrode rod in the coating furnace tube;

[0065] F. Vacuumize the coating furnace tube to below 20mbar, close all valves, and keep the pressure in the tube for 30s. During this ...

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Abstract

Multi-coating technology comprises the following steps: oxidizing the surface of a silicon wafer, vacuumizing a coating furnace tube after an oxidizing layer achieves 5-10nm, using NH3 with the flow of 3.0-8.0slm to form plasma in a high frequency glowing condition to pretreat the surface of the silicon wafer, and depositing at least two silicon nitride films in sequence. In the invention, an oxo layer is additionally arranged on the surface of the silicon wafer, larger amount of surface state on the surface of the silicon wafer can be eliminated, and simultaneously the plurality of layers of silicon nitride films are deposited, the passivation effect of the surface of a silicon battery is greatly improved, the reflective rate of the surface of the silicon battery is reduced, and the conversion rate of the silicon battery is improved.

Description

technical field [0001] The invention relates to a multi-layer coating process, which belongs to the field of solar cell manufacturing. Background technique [0002] In the solar cell process, the surface anti-reflection coating process is a very important step, which directly determines how much sunlight the solar cell can absorb. [0003] Traditional anti-reflection film on the surface of solar cells uses silicon nitride thin film. The characteristics of silicon nitride as the surface anti-reflection film are that the process is simple, easy to industrialized production, and the cost is low, but the disadvantages are also obvious: silicon nitride as the surface anti-reflection film The anti-reflection film is on the battery and components, and the refractive index and thickness of the silicon nitride film cannot be matched to the optimal value at the same time, resulting in a certain packaging loss at the component end after packaging; at the same time, due to the main cons...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): H01L31/18H01L31/0216
CPCY02P70/50
Inventor职森森陈作庚陈黔陈红利唐磊
OwnerZHEJIANG BEYONDSUN PV