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Wing plate type three-dimensional light-emitting diode (LED) radiator

An LED radiator, three-dimensional technology, applied in semiconductor devices of light-emitting elements, lighting and heating equipment, cooling/heating devices of lighting devices, etc. , good economic and social benefits, the effect of prolonging life

Inactive Publication Date: 2012-07-18
SHAANXI TANGHUA ENERGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, it is more difficult to conduct the heat of the LED chip through the heat sink more effectively.

Method used

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  • Wing plate type three-dimensional light-emitting diode (LED) radiator
  • Wing plate type three-dimensional light-emitting diode (LED) radiator

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Experimental program
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Effect test

Embodiment Construction

[0019] The present invention will be described in detail below in combination with specific embodiments.

[0020] The wing plate type three-dimensional LED heat sink of the present invention is suitable for LED lamps with a single integrated chip not greater than 40W. The radiator is provided with two layers of sheet-shaped cooling fins 1 , and a sheet-shaped heat conducting sheet 2 is interposed between the two cooling fins 1 . Integrated LED chips 4 are embedded on one layer of heat sink 1 . Both ends of the heat sink 1 are provided with folded sheets, and the folded sheets are provided with bulging curved surfaces, and the folded sheets and the curved surfaces thereon form an airfoil-shaped double-layer heat dissipation structure. Strip grooves are arranged on the folded pieces and the curved surface at both ends of the heat sink 1 . Edges at both ends of the heat conduction sheet 2 are sealed with heat conduction glue 3 . The wing-shaped thin-plate-shaped heat sink 1 ha...

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Abstract

The invention relates to a wing plate type three-dimensional light-emitting diode (LED) radiator. A mode of installing a chip under the radiator is adopted by a traditional radiator structure of a high-power LED lamp, and the effective heat dissipation substantially relies on the surface area of the radiator. Two layers of thin-plate-shaped cooling fins are arranged, a sheet-shaped heat-conducting piece is clamped between the two cooling fins, an integration LED chip is embedded on one layer of cooling fin, two ends of each cooling fin are provided with turnup pieces which are provided with plump curved surfaces, and the turnup pieces and the curved surfaces on the turnup pieces form a wing-shaped double-layer heat dissipation structure. The turnup pieces arranged at two ends of the cooling fins and the curved surfaces are provided with strip-shaped open grooves, and the edges of two ends of the heat-conducting piece are sealed by sealing heat-conducting glue. The three-dimensional wing plate type heat-conducting piece structure is adopted, the heat dissipation area of the LED chip is increased, the heat-conducting piece is arranged so as to improve heat dissipation efficiency, and the service life of the LED lamp is effectively prolonged.

Description

technical field [0001] The invention belongs to the technical field of LED lamps, and in particular relates to a wing plate type three-dimensional LED radiator. Background technique [0002] As a new generation of green and environmentally friendly solid-state lighting source, light-emitting diode LED has a series of advantages such as low power consumption, pure light color, all solid state, light weight, small size, and environmental protection. When the LED emits light, part of the energy will be converted into heat, which will increase the temperature of the LED chip. The temperature has a great influence on the working performance of the LED chip. High temperature will lead to the reduction of photons emitted by the chip, the decrease of color temperature quality, the acceleration of chip aging, and the shortening of device life and other serious consequences. Therefore, in order to ensure the normal operation of the LED, the heat emitted by it must be dissipated in t...

Claims

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Application Information

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IPC IPC(8): F21V29/00F21Y101/02F21V29/70F21Y115/10
Inventor 胡民浩高辉
Owner SHAANXI TANGHUA ENERGY
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