Substrate assembly carrier using electrostatic force

Abstract

A portable electrostatic chuck carrier includes a holder having a dielectric top surface, and bipolar electrodes under the dielectric top surface. The bipolar electrodes include positive electrodes and negative electrodes electrically insulated from the positive electrodes. The positive electrodes and the negative electrodes are allocated in an alternating pattern in a plane substantially parallel to the dielectric top surface. The invention also provides a substrate assembly carrier using an electrostatic force.

Description

technical field [0001] The present invention relates to the field of semiconductors, and more particularly, to a substrate assembly carrier. Background technique [0002] In the packaging of integrated circuits, the die may be packaged on a laminate substrate that includes metal connectors that may pass electrical signals between opposite sides of the laminate substrate. The die may be bonded to one side of the laminate substrate using flip chip bonding and a reflow may be performed to melt the solder bumps interconnecting the die and laminate substrate. [0003] Laminate substrates use materials that can be easily fabricated. However, these materials are prone to warping from the elevated temperatures used in the reflow of solder bumps. Such warpage can lead to irregular connections and / or bump cracks and lead to poor component yield. Generally, in order to reduce the warpage of the laminated substrate, the laminated substrate can be squeezed from both sides using a jig....

AI Technical Summary

Problems solved by technology

This can lead to the introduction of human error into the process

Therefore, process steps involving the use of laminated substrates are difficult to automate

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