Liquid phase connected die forging integral forming method of material
Patent Information
- Authority / Receiving Office
- CN Β· China
- Current Assignee / Owner
- HARBIN INST OF TECH
- Publication Date
- 2012-10-17
Smart Images
Figure 1 Figure 2 Figure 3
Abstract
Description
technical field
[0001] The invention relates to a material forming method. Background technique
[0002] Material connection is to connect two or more materials (including metals and non-metals, composite materials, compounds, etc.) together through certain process conditions to form a complete structure with certain performance. The material connection structure has the excellent properties of various materials, so it has been widely used in aerospace, space technology, nuclear industry, microelectronics, automobile, petrochemical and other fields. The progress of modern science and technology has increasingly increased the requirements for material science and engineering technology. The development of new high-performance structural parts and advanced connection technology has become an urgent problem for high-tech enterprises. areas are more evident. For example, the heat pipe structure in the aerospace field and the national production field adopts the plate and tube ...