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Semiconductor device with bonding pad and shielding structure and manufacturing method thereof

A bonding pad and shielding structure technology, applied in semiconductor devices, electrical solid devices, electrical components, etc., can solve problems such as bonding pads falling off

Active Publication Date: 2016-05-25
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the problem with thinner metal layers is that the bond pads formed in these layers may exhibit peeling or other defects

Method used

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  • Semiconductor device with bonding pad and shielding structure and manufacturing method thereof
  • Semiconductor device with bonding pad and shielding structure and manufacturing method thereof
  • Semiconductor device with bonding pad and shielding structure and manufacturing method thereof

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Embodiment Construction

[0034] The following disclosure provides many different embodiments or examples in order to achieve the different features of the invention. Specific examples of components and arrangements are described below to simplify the present disclosure. These are of course examples only and are not intended to be limiting. For example, the following description of a first component formed on a second component may include embodiments in which the first component and the second component are formed in direct contact, and may also include embodiments in which additional components are formed between the first component and the second component. An embodiment in which the first part and the second part are not in direct contact. In addition, the present invention may repeat reference numerals and / or letters in various embodiments. This repetition is for brevity only and does not by itself suggest a relationship between the various embodiments and / or structures discussed. It will be ap...

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Abstract

A semiconductor device, comprising: a device substrate having front and back surfaces corresponding to a front surface of the semiconductor device and a back surface of the semiconductor device; a metal member formed on the front surface of the device substrate; and a bonding pad provided on the front surface of the semiconductor device on the backside and in electrical communication with the metal features; and a shielding structure disposed on the backside of the device substrate, wherein the shielding structure and the bond pads have different thicknesses from each other. The present invention also provides a semiconductor device having a bonding pad and a shielding structure and a method of manufacturing the same.

Description

[0001] Cross References to Related Applications [0002] This application is related to U.S. Patent Application No. 13 / 112,755 (Attorney Docket No. 2011-0379 / 24061.1815), filed concurrently herewith on May 20, 2011, entitled "Semiconductor Device Having a Bonding Pad and Method of Manufacturing the Same," the entire contents of which are hereby incorporated by reference. technical field [0003] The present invention relates to the field of semiconductors, and more particularly, the present invention relates to a semiconductor device with a bonding pad and a shielding structure and a manufacturing method thereof. Background technique [0004] The semiconductor integrated circuit (IC) industry has undergone rapid development. Technological advances in IC materials and design have produced successive generations of ICs, each with smaller and more complex circuits than the previous generation. However, these improvements have also increased the complexity of handling and manuf...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/146H01L29/40
CPCH01L27/14627H01L27/1464H01L24/03H01L24/05H01L2924/14H01L2224/03831H01L27/14623H01L2224/0345H01L2224/0391H01L2224/04042H01L2224/05567H01L2224/05624H01L2224/05647H01L2224/05666H01L2224/05681H01L2224/05684H01L27/14621H01L27/14685H01L27/14698H01L2924/01327H01L2924/00014H01L2924/15788H01L2924/12042H01L2924/12043H01L2924/01029H01L2924/00H01L2224/05552H01L27/146H01L27/14632H01L27/14636H01L27/14687H01L24/06H01L31/02005H01L31/02327
Inventor 蔡双吉杨敦年刘人诚王文德林政贤何承颖
Owner TAIWAN SEMICON MFG CO LTD
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