Transduction component with surface-mounted semi-conductive bridge for electric initiating explosive device

A technology for surface encapsulation and electrical pyrotechnics, which is used in weapon accessories, offensive equipment, blasting cylinders, etc. It can solve the hidden dangers of pyrotechnic function reliability, low product qualification rate, poor mechanical strength, etc., and achieve firm and reliable welding strength. , The product has a high pass rate, and the effect of avoiding damage

Active Publication Date: 2013-01-02
NANJING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] 1. The method of connecting the circuit with wire bonding has high requirements for the quality of the bonding fingers in the bonding process, which is prone to false welding of the bonding points, and the solder joints are not firm enough to cause open circuit hazards; there are also poor mechanical strengths, and pyrotechnic products In the process of pressing powder, transportation and high overload, it will cause damage to the bonding point, so there are hidden dangers to the reliability of the pyrotechnics.
[0005] 2. The existing electrical connection method between the semiconductor bridge chip and the printed circuit board consumes materials (needs metal wire), consumes energy (sticking the chip and dispensing glue twice for high-temperature drying), time-consuming, and high labor costs; secondly, due to There are many processes and complex processes. In each process, there are substandard products, which makes the product qualification rate low; the above factors are all factors that cause the product cost to be reduced. Due to the high price, many middle and low-end pyrotechnics are restricted. The product uses a semiconductor bridge with excellent performance as the energy source

Method used

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  • Transduction component with surface-mounted semi-conductive bridge for electric initiating explosive device
  • Transduction component with surface-mounted semi-conductive bridge for electric initiating explosive device
  • Transduction component with surface-mounted semi-conductive bridge for electric initiating explosive device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Embodiment 1: A surface-mounted semiconductor bridge transducing element used for electrical explosive products, including electrode plug 1, foot wire electrodes of the electrode plug, printed circuit board 4, and printed circuit board 4 in contact with electrode plug 1 One side is the B side, and the other side is the A side. Two pad electrodes are respectively symmetrically arranged on the two sides of the printed circuit board 4, and three conductive electrodes for connecting the chip are left on the third pad electrode 11 of the B side. The third pad electrode marker 13 of the glue, on the fourth pad electrode 12 of the B side, there are three fourth pad electrode markers 14 of the conductive glue for connecting the chip, which are arranged on the printed circuit board 4 Two electrode holes for passing through the leg electrode of the electrode plug, the electrode hole of the first leg electrode 2 of the electrode plug passes through the first pad electrode 6 of the ...

Embodiment 2

[0027]Embodiment 2: A surface-mounted semiconductor bridge transducing element used for electrical explosive products, including electrode plug 1, foot wire electrodes of the electrode plug, printed circuit board 4, and printed circuit board 4 in contact with electrode plug 1 One side is the B side, and the other side is the A side. Two pad electrodes are symmetrically arranged on the two sides of the printed circuit board 4 respectively, and five pad electrodes 11 for connecting chips are left on the B side. The mark Yu 13 of the third pad electrode conductive glue, five fourth pad electrode mark Yu 14 of the conductive glue used to connect the chip is left on the fourth pad electrode 12 of the B side, on the printed circuit board 4 There are two electrode holes for passing through the leg electrodes of the electrode plug, and the electrode holes of the first leg electrode 2 of the electrode plug pass through the first pad electrodes 6 and B of the A side of the printed circui...

Embodiment 3

[0028] Embodiment 3: A surface-mounted semiconductor bridge transducing element for electrical explosive products, including an electrode plug 1, a leg electrode of the electrode plug, a printed circuit board 4, and a printed circuit board 4 in contact with the electrode plug 1 One side is the B side, and the other side is the A side. Two pad electrodes are arranged symmetrically on the two sides of the printed circuit board 4, and eight pad electrodes 11 for connecting chips are left on the B side. The mark Yu 13 of the third pad electrode conductive glue, on the fourth pad electrode 12 of the B side, there are eight fourth pad electrode mark Yu 14 for connecting the conductive glue of the chip, on the printed circuit board 4 There are two electrode holes for passing through the leg electrodes of the electrode plug, and the electrode holes of the first leg electrode 2 of the electrode plug pass through the first pad electrodes 6 and B of the A side of the printed circuit board...

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PUM

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Abstract

The invention discloses a transduction component with a surface-mounted semi-conductive bridge for an electric initiating explosive device. The component comprises an electrode plug, a leg wire electrode of the electrode plug and a printed circuit board, wherein two pad electrodes are arranged on two faces of the printed circuit board respectively and symmetrically, a plurality of conductive adhesive mark jars which are used for connecting chips are arranged on the pad electrode of which the face is in contact with the electrode plug, two electrode holes which are used for penetrating through the leg wire electrode of the electrode plug are arranged on the printed circuit board, the electrode holes penetrate through the pad electrodes of two faces of the printed circuit board and are connected with the pad electrodes, an opening is arranged in the center of the printed circuit board, a semi-conductive bridge chip is installed on the face of the printed circuit board, which is in contact with the electrode plug, and the opening aligns to the bridge region of the semi-conductive bridge chip. The opening is arranged in the center of the printed circuit board, a surface assembly technology of an inverted chip is used, the chips can be connected with printed circuit board electrodes reliably through one process, the structure is simple, the welding strength is high, the action is reliable, the product pass percentage is high and the production cost is low.

Description

technical field [0001] The invention belongs to the field of transducer elements in electro-technical products, in particular to a surface-mounted semiconductor bridge transducer element used in electro-technical products. Background technique [0002] Electrotechnical products are widely used in military weapon point fire transmission systems and civilian blasting equipment. Electrotechnical products often use glowing bridge wires as transducer elements. The bridge wire is a metal resistance wire with a positive temperature coefficient. When the current passes, the bridge wire heats up and ignites the pyrotechnic agent wrapped around the bridge wire, so that the pyrotechnic product can achieve the functions of ignition, detonation, and work. The bridge wire type There are obvious disadvantages in electrical explosive devices, mainly because they need to input a lot of energy; and the action time is long and scattered; they are also easily affected by electromagnetic radiati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F42B3/13
Inventor 秦志春田桂蓉叶家海司马博羽
Owner NANJING UNIV OF SCI & TECH
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