Double-probe star sensor and method for designing same
A star sensor, double-probe technology, applied in the space field
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0053] Example 1: Combining Figure 1-Figure 14 , a dual-probe star sensor of the present invention, which is composed of two imaging probe modules, a CPU data processing module and a power conversion module, the two imaging probe modules are respectively connected to the CPU processing board, the interface adopts LVDS, the two The two imaging probe modules are independent of each other. Considering the problem of transmission time delay, it is not the whole image that the two imaging probe modules transmit to the CPU data processing board, but the star image coordinates in the image. In order to facilitate the CPU data processing board to compare the two Data fusion of two imaging probe modules. In addition to transmitting the star image coordinates in the image to the CPU data processing board, the two imaging probe modules also send the current probe exposure time to the CPU data processing board. The two imaging probe modules are connected to the CPU. In addition to the da...
Embodiment 2
[0084] Example 2: Combining Figure 12, as shown in Figure 12 is a power module implementation of a dual-probe star sensor, in which the power conversion module that converts the input +28V to +5V mainly uses FMSA-461 and MSA2805S devices, the CMOS imaging device uses CMV4000, and the FPGA device uses The EP2C8Q208I8 chip of ALTERA Company, the configuration file of the EP2C8Q208I8 chip is placed in the EPCS4 device, and the SRAM uses IS61LPS204818A. The chip is a 2M×18-bit memory, so two chips are needed, which are the high 18-bit address and the low 18-bit address. The DSP device uses TI's TMS320VC33 chip, which is a 32-bit floating-point device. The program SRAM uses Is611v512616. This chip is a 16-bit memory, so two chips are required, which are high 16 bits and low 16 bits, and RS422 The device adopts 82C52 chip, the FLASH device adopts AT49BV162A, the chip is a 16-bit memory, so two chips are needed, which are the upper 16 bits and the lower 16 bits, the LVDS device adop...
Embodiment 3
[0085] Example 3: Binding Figure 6-Figure 12 , in order to verify the accuracy of the dual-probe star sensor, and compared it with the accuracy of the single-probe star sensor for field star observation. The experiment was divided into three groups.
[0086] The first group of experimental methods are as follows: turn off the power supply of the imaging probe module (2) of the dual-probe star sensor. At this time, only the imaging probe module (1), CPU data processing module and power module work (as shown in Figure 6), the imaging probe The module (1) is randomly aligned to a certain sky area in the sky, and remains relatively stationary with the earth. The CPU data processing module periodically sends a star image coordinate request to the imaging probe module (1), and the data processing module receives the request sent by the imaging probe module (1). After receiving the star image coordinate data, identify these star image coordinates, use the recognition result to calc...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap