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Jigs with controlled spacing for bonding pipe cores onto package substrates

A technology for packaging substrates and fixtures, which is applied in the manufacture of electrical components, electrical solid devices, semiconductors/solid devices, etc., and can solve problems such as increased expansion length and warpage

Active Publication Date: 2013-03-27
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, although the laminate substrate is smooth before reflow, during the bonding reflow process, the elevated temperature causes the laminate substrate and the jig to have different expansion lengths.
Although precautions can be taken to reduce warpage of laminated substrates during reflow, warpage can still occur after reflow

Method used

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  • Jigs with controlled spacing for bonding pipe cores onto package substrates
  • Jigs with controlled spacing for bonding pipe cores onto package substrates
  • Jigs with controlled spacing for bonding pipe cores onto package substrates

Examples

Experimental program
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Embodiment Construction

[0027] The making and using of embodiments of the invention are discussed in detail below. It should be appreciated, however, that the embodiments provide many applicable inventive concepts that can be implemented in a wide variety of specific contexts. The specific embodiments discussed are exemplary only, and do not limit the scope of the invention.

[0028] According to an embodiment, there is provided a jig that allows a laminated substrate to be fixed therebetween for expansion and contraction during a reflow process. Variations of the embodiments are discussed. Throughout the drawings and described embodiments, the same reference numerals are used to designate the same elements.

[0029] Figure 1A A schematic top view of the lower jig 20 is shown. In an exemplary embodiment, the lower jig 20 includes a base material 22 formed of a dielectric material, or metal, or the like. The lower jig 20 may have a rectangular shape, but other shapes may also be used. The lower...

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PUM

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Abstract

A device includes a lower jig and an upper jig, wherein the lower jig and the upper jig are configured to secure a package substrate. The lower jig includes a first base material and a first plurality of features attached to the first base material. The first plurality of features is disposed adjacent to a peripheral of the lower jig. The upper jig includes a second base material and a second plurality of features attached to the second base material. The second plurality of features is disposed adjacent to a peripheral of the upper jig. The first plurality of features is configured to be attracted to the second plurality of features by a magnetic force. The invention also provides jigs with controlled spacing for bonding pipe cores onto package substrates.

Description

technical field [0001] The present invention generally relates to the field of semiconductors, and more particularly, to a fixture for packaging a substrate. Background technique [0002] In the packaging of integrated circuits, the die may be packaged over a packaging substrate (sometimes referred to as a laminate substrate) that includes metal connections that may pass electrical signals between opposing sides of the laminate substrate. The die may be bonded over one side of the laminate substrate using flip chip bonding and reflow performed to melt the solder bumps interconnecting the die and the laminate substrate. [0003] Laminate substrates can use materials that can be easily laminated. However, these materials are prone to warpage due to temperature rise during reflow of the solder bumps. Warpage can cause irregular joints and / or bump cracks and lead to poor assembly yield. Conventionally, in order to reduce the warpage of the laminated substrate, the laminated s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H01L21/687
CPCH01L24/00H01L24/75H01L24/81H01L24/95H01L2224/13101H01L2224/16225H01L2224/32225H01L2224/73204H01L2224/75272H01L2224/81011H01L2224/81815H01L2224/8191H01L2224/92125H01L2924/014H01L2924/00014H01L2924/00
Inventor 萧义理余振华刘重希黄见翎
Owner TAIWAN SEMICON MFG CO LTD