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Radiating device and manufacturing method thereof

A technology of a heat dissipation device and a manufacturing method, which is applied in the direction of cooling/ventilation/heating transformation, etc., can solve the problems such as the reduction of heat transfer efficiency, achieve the effects of long service life, increase the close fit effect, and avoid the phenomenon of thermal resistance

Inactive Publication Date: 2013-04-03
ASIA VITAL COMPONENTS SHENZHEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0009] 3. Reduced heat transfer efficiency

Method used

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  • Radiating device and manufacturing method thereof
  • Radiating device and manufacturing method thereof
  • Radiating device and manufacturing method thereof

Examples

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Embodiment Construction

[0061] The above-mentioned purpose of the present invention and its structural and functional characteristics will be described based on the preferred embodiments of the accompanying drawings.

[0062] see figure 2 , image 3 , Figure 4 , is the three-dimensional disassembly and assembly and the A-A sectional view of the first embodiment of the heat dissipation device of the present invention. The heat dissipation device 1 includes: a body 11 and at least one fixing hole 111;

[0063] The main body 11 has a first plate body 112 and a second plate body 113 correspondingly covered to form a chamber 114, the chamber 114 has a first side 1141 and a second side 1142 and working fluid 115 and multiple A support column 116, the surface of the chamber 114 is provided with at least one capillary structure 117, the two ends of the support column 116 are respectively connected to the first and second sides 1141, 1142 of the aforementioned chamber 114, and the capillary structure 117 ...

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Abstract

The invention discloses a radiating device and a manufacturing method thereof. The radiating device comprises a body and at least one fixing hole, wherein the body is provided with a first plate body and a second plate body which are correspondingly buckled to form a chamber; the chamber is provided with working fluid, a plurality of supporting posts and at least one capillary structure, wherein the fixing hole can be selectively formed in any one part of the supporting posts of the body and penetrates through the supporting posts. Through the radiating device, the air tightness of the inner chamber of the body can be ensured, and a temperature equalizing board can be tightly combined with other elements.

Description

technical field [0001] A heat sink and its manufacturing method, especially a fixed structure of the heat sink. When the fixed structure is installed, the body of the heat sink must not be damaged, thereby preventing the internal cavity of the heat sink from leaking and affecting heat transfer. Efficient heat sink and method of manufacturing the same. Background technique [0002] As the current electronic equipment is gradually advertised as light and thin, the size of each component must be reduced accordingly. However, the heat generated by the reduction in the size of electronic equipment has become a major obstacle to the improvement of the performance of electronic equipment and systems. Despite the ever-shrinking dimensions of the semiconductors forming electronic components, there is a continuing demand for increased performance. [0003] Vapor chamber is a kind of heat conduction application with a wide range of surface to surface, which is different from the point...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
Inventor 杨修维
Owner ASIA VITAL COMPONENTS SHENZHEN CO LTD
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