Fixing structure of heat sink

Abstract

A fixing structure of a radiating device comprises a body and a plurality of fixing elements. The body is provided with a chamber, the chamber is provided with a first side, a second side, a plurality of supports and working fluid, the supports are connected with the first side and the second side, a plurality of connecting portions corresponding to the supports of the chamber are concavely arranged on the outside of the body, and the fixing elements are connected with the connecting portions. The fixing structure has the advantages that air tightness of the chamber inside the body can be assuredly kept when the fixing elements are arranged on the radiating device, and the radiating device can be closely combined with other elements.

Description

technical field [0001] A fixed structure of a heat sink, especially a fixed structure of a heat sink, when the fixed structure is installed, the body of the heat sink must not be damaged, thereby preventing the internal cavity of the heat sink from leaking and affecting the heat transfer efficiency The fixed structure of the cooling device. Background technique [0002] As the current electronic equipment is gradually advertised as light and thin, the size of each component must be reduced accordingly. However, the heat generated by the reduction in the size of electronic equipment has become a major obstacle to the improvement of the performance of electronic equipment and systems. Despite the ever-shrinking dimensions of the semiconductors forming electronic components, there is a continuing demand for increased performance. [0003] As semiconductors shrink in size, the resulting heat flux increases. The heat flux increase creates challenges in cooling the product beyond...

AI Technical Summary

Problems solved by technology

[0006] It is known that the vapor chamber is used in combination with a substrate and conducts the heat of the heating element on the substrate through the vapor chamber. The known technology is mainly in the position where the vapor chamber avoids the chamber, that is, the four couplings of the vapor chamber. A copper column with internal screw teeth is perforated at each place, and at least one hole is opened on the base plate relative to the position of the copper column on the uniform temperature plate, and then the copper column and the hole are simultaneously threaded through a screw locking element in a screw-locked manner The vapor chamber is fixed on the base plate, but because the copper pillars are installed at the four couplings of the chamber, the distance between the chamber and the heating element is far away, and the chamber cannot be closely attached to the heating element after being fixed. In order to improve the above-mentioned problem of not being able to fit tightly, the industry will directly arrange the copper pillars in the vicinity of the vapor chamber and the place where the heating element is pasted, so the copper pillars directly penetrate The chamber part of the vapor chamber can increase the tightness during assembly to prevent thermal resistance, but the chamber of the chamber loses airtightness after being penetrated and damaged by the copper pillars, and the interior of the chamber no longer has Vacuum state, and because the copper pillar penetrates and destroys the chamber, the flow path of the working fluid inside it may be blocked, resulting in a decrease in heat transfer efficiency, and even serious leakage may occur, which will cause the heat transfer effect of the chamber to be lost; Therefore known technology has following shortcoming:

[0007] 1. It is easy to produce thermal resistance phenomenon;

[0008] 2. Reduced heat transfer efficiency

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