heat sink

A technology for radiators and heat dissipation strips, which is applied in the direction of heat sinks, indirect heat exchangers, heat transfer modification, etc., can solve the problems of slow heat dissipation and inapplicability, and achieve the effect of enhancing heat radiation

Inactive Publication Date: 2015-08-19
郭进和
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  • Application Information

AI Technical Summary

Problems solved by technology

The heat of the base gradually decreases from the center of the chip to the outer edge, that is to say, the heat in the middle of the base is the highest, but because the cavity of the heat conduction shell is a closed cavity, the air in the closed cavity cannot circulate, almost Still, the heat in the middle of the base will only be slowly conducted to the heat sink through the still air in the cavity of the heat conduction shell. The heat sink with this structure can only dissipate heat by heat conduction, not by heat convection. Not only is the heat dissipation slow, but also because a large amount of heat is accumulated in the heat-conducting shell, it is actually difficult to effectively dissipate heat from the chip of the LED component, especially not suitable for concentrated heat-generating high-power chips such as the above-mentioned high-power LEDs packaged in COB Heat dissipation of chip components

Method used

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Embodiment Construction

[0024] Below in conjunction with accompanying drawing and specific embodiment, the present invention will be further described:

[0025] See figure 1 , the present invention relates to a heat sink, and its preferred embodiment at least includes a heat conduction base 10 and a plurality of primary heat dissipation strips 20 .

[0026] The heat conducting base 10 includes a top surface 12 , a bottom surface opposite to the top surface 12 , and a side surface (not shown) disposed between the top surface 12 and the bottom surface. In this embodiment, the heat conducting base 10 is in the shape of a cylinder, and the top surface 12 is flat. In other embodiments, the heat conducting base 10 may also be in the shape of a cube.

[0027] See figure 2 and image 3 , each first-level cooling strip 20 is arranged on the top surface 12 of the heat-conducting base 10, and is perpendicular to the top surface 12 of the heat-conducting base 10. A cylindrical convection channel 27 is forme...

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Abstract

A radiator comprises a heat conduction base (10) and a plurality of primary radiating strips (20). Each primary radiating strip (20) is disposed on a top surface (12) of the heat conduction base (10) and is perpendicular to the top surface (12) of the heat conduction base (10). The primary radiating strips (20) are arranged in a circumferential direction and surround to form a column-shaped convection channel (27), a heat convection channel (25) is formed between every two adjacent primary radiating strips (20), and each heat convection channel (25) is communicated with the column-shaped convection channel (27). The radiator can carry out radiation in a heat conduction mode, a heat convection mode, and a heat radiation mode at the same time. The radiator has rapid and good radiating effect, is especially suitable for radiation of large-power chips, and saves materials and reduces the cost.

Description

technical field [0001] The invention relates to a radiator. Background technique [0002] A COB (chip on board, chip on board) packaged LED lamp generally includes a COB-packaged LED component, a reflector cover set on the LED component, and a heat sink installed on the back of the base of the LED component. Among them, the heat sink generally includes a cylindrical heat-conducting shell and a number of heat-dissipating fins evenly arranged outside the side wall of the heat-conducting shell. When the heat sink with this structure is installed on the back of the base of the LED component, the chips of the LED component The cavity of the quasi-heat-conducting shell, that is, the cavity of the heat-conducting body aligned with the middle of the base. The heat of the base gradually decreases from the center of the chip to the outer edge, that is to say, the heat in the middle of the base is the highest, but because the cavity of the heat conduction shell is a closed cavity, the...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): F21V29/77F21Y101/02F21V29/74
CPCF21Y2101/02F21V29/74F21V29/85F21Y2115/10H01L23/3677F21V29/77F21V29/83H01L33/648F28D2021/0029F28F3/04F28F3/048F28F13/06F28F13/18F28F2215/10F28F2245/06
Inventor郭进和
Owner郭进和