Cutting method of alumina substrate

An alumina and substrate technology, applied in glass cutting devices, fine working devices, glass manufacturing equipment, etc., can solve the problems of wear of scoring wheel, hard ceramic substrate, etc., and achieve the effect of small breaking load

Inactive Publication Date: 2016-12-28
MITSUBOSHI DIAMOND IND CO LTD
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  • Abstract
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  • Claims
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Problems solved by technology

[0003] However, since the ceramic substrate is harder than the glass substrate, the scribing wheel is prone to wear when cutting by scribing and breaking

Method used

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  • Cutting method of alumina substrate
  • Cutting method of alumina substrate
  • Cutting method of alumina substrate

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Embodiment Construction

[0034] The target substrate of the present invention is an alumina substrate. Aluminum oxide (Al 2 o 3 ) content is, for example, 90% by weight or more, and the other part is mixed with additives such as binder (sintering aid), and is widely used as a substrate for semiconductor chips and the like. In the case of using an alumina substrate as a substrate of a chip component, for example, it is cut into a small chip shape of 2 mm square or less (1 mm square, etc.). When used as a substrate on which a plurality of parts are mounted, for example, it must be cut into a large size such as 100 mm square. If the alumina substrate is scribed and divided to be broken, if the angle of the knife tip is increased during scribing, the breaking strength can be reduced, thereby improving the quality of the end surface. Therefore, the inventors used a scoring wheel with a tip angle of 140° for alumina substrates, appropriately changed the crack permeability, divided the cracks after scorin...

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Abstract

PROBLEM TO BE SOLVED: To scribe an alumina substrate, and to select a knife tip angle when scribing and scribing penetrance.SOLUTION: When scribing an alumina substrate, scribing is performed by using a scribing wheel with an angle of a knife tip angle exceeding 135°, with a crack penetrance of 20% or more. Then breaking is performed along a scribing line. By this way, the alumina substrate can be cut while securing the quality of end faces.

Description

technical field [0001] The invention relates to a cutting method of an alumina substrate which is divided after scoring the alumina substrate. Background technique [0002] Conventionally, when cutting a glass substrate, a scribing device is used for scribing (scribing lines are formed), and then a breaking device is used for breaking. When scribing is performed by a scribing device, if the scribing depth is shallow, cracks are likely to occur on the end surface during breaking. On the other hand, if the depth is deep, separation is easy, and even after breaking, the burrs on the end surface are smaller, or cracks are less likely to occur, and the quality of the end surface tends to be good. Therefore, by deepening the crack permeability to, for example, about 80% of the plate thickness, it is possible to perform splitting with improved quality. [0003] However, since a ceramic substrate is harder than a glass substrate, the scribing wheel tends to wear out when cutting b...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D5/00
CPCB26D3/06B28D5/0011C03B33/105
Inventor 武田真和村上健二田村健太
Owner MITSUBOSHI DIAMOND IND CO LTD
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