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Reactive apparatus for vapor deposition

A vapor deposition and reactor technology, applied in the direction of gaseous chemical plating, metal material coating process, coating, etc., can solve the problems affecting the quality of the film, the durability of the carrier and the cost, etc.

Active Publication Date: 2014-01-29
EPISTAR CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the durability of the carrier will also affect the cost of production
Since the surface of the carrier on which the substrate is placed will be damaged during use, which will affect the quality of the film, it must be solved by replacing the carrier

Method used

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  • Reactive apparatus for vapor deposition
  • Reactive apparatus for vapor deposition
  • Reactive apparatus for vapor deposition

Examples

Experimental program
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Embodiment Construction

[0031] The present invention discloses a reactor 200, which includes a carrier and a heating device. like image 3 As shown, the carrier has a surface 240 including a plurality of grooves 242 for carrying the substrate 22, and also includes a first carrier 28 and a second carrier 24 located on the first carrier 28, wherein the second carrier The thermal conductivity of the first carrier 24 is greater than that of the first carrier 28 . The carrier gas mixed with the saturated vapor of the reaction source material is passed into the reactor 200, and the heater 26 also heats the carrier at the same time. When the temperature reaches a predetermined temperature, the gas atoms start to deposit on the substrate 22 and form a thin film. In one embodiment, the reactor 200 is used for vapor deposition, wherein the vapor deposition may be metal organic chemical vapor deposition (MOCVD). In one embodiment, the heater 26 is an electromagnetic wave heating device, which includes an elec...

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PUM

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Abstract

This invention discloses a reactive apparatus for vapor deposition, comprising a carrier and a heating device. The carrier comprises a first carrier and a second carrier formed on the first carrier. The electromagnetic wave heating coefficient of the first carrier is higher than that of the second carrier.

Description

technical field [0001] The invention relates to a reactor applied to vapor deposition, which includes a heating device and a carrier, and the carrier also includes a second carrier and a first carrier whose electromagnetic wave heating coefficient is greater than that of the second carrier. Background technique [0002] In the industrial production process, it is necessary to form a thin film on the surface of various products for various application requirements, for example, by evaporation. Since the principle of evaporation is to form a film of various materials on the surface of the product at the atomic or molecular size, it is possible to form a film with different thickness and composition by controlling the reaction time, temperature and gas flow. Evaporation is often used in various industries and daily necessities, such as the electronics industry with high precision and small size. [0003] According to the mechanism of material reaction in the process of film fo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C16/458C23C16/46
CPCC23C16/45597C23C16/4585C23C16/4586C23C16/46
Inventor 欧震王韦涵翁健忠
Owner EPISTAR CORP