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Heat radiation device

A technology of heat dissipation device and mounting holes, which can be applied in the direction of cooling/ventilation/heating transformation, etc., and can solve problems such as unfavorable fastener assembly

Inactive Publication Date: 2014-02-12
CHAMP TECH OPTICAL FOSHAN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, after the first buckle is locked, because the spring of the first buckle is compressed, a large downward force is generated on one corner of the radiator, causing the other corners of the radiator to tilt and tilt. It is not conducive to the assembly of several other fasteners

Method used

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  • Heat radiation device
  • Heat radiation device
  • Heat radiation device

Examples

Experimental program
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Embodiment Construction

[0017] see figure 1 , shows an assembly diagram of the heat sink 100 according to the first embodiment of the present invention. The heat dissipation device 100 includes a base plate 10 , a fin set 30 mounted on the base plate 10 , a heat pipe 40 installed inside the fin set 30 , and a fastener 20 for fixing the base plate 10 on a circuit board.

[0018] Please also see Figure 2-3 , the substrate 10 is roughly square, and a square heat absorbing plate 50 is inlaid in the middle of it. The substrate 10 includes two grooves 11 extending through opposite sides of the substrate 10 , and the two grooves 11 pass through the heat absorbing plate 50 . like figure 2 In the direction shown, the groove 11 communicates with the outer space of the front and rear boundaries of the substrate 10 . The fin set 30 is vertically disposed on the substrate 10 and perpendicular to the groove 11 . The fin set 30 includes a plurality of second fins 32 disposed in the middle of the substrate 10...

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PUM

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Abstract

Provided is a heat radiation device which is applied to perform heat radiation on electronic elements installed on a circuit board. The heat radiation device comprises a substrate and a buckling tool which is used for fixing the substrate on the circuit board. The substrate comprises an installation hole which is used for installing the buckling tool. The buckling tool comprises a first fixing part which is arranged on one side of the substrate, a second fixing part which penetrates through the installation hole of the substrate and is combined with the first fixing part, an elastic element which is sleeved on the first fixing part, a pad which is clamped between the elastic element and the second fixing part, and a blocking sheet which is arranged on the second fixing part. External diameters of the pad and the blocking sheet are both greater than hole diameter of the installation hole. The substrate is arranged between the pad and the blocking sheet. Distance between the pad and the blocking sheet is greater than thickness of the substrate. During a process that the second fixing part is locked into the circuit board, the pad moves from the upper part of the substrate towards the substrate until the pad abuts against the substrate.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device installed on a circuit board. Background technique [0002] With the rapid development of the computer industry, more and more heat is generated by heat-generating electronic components such as micro-processing chips. components to dissipate heat. The installation of the heat dissipation device generally requires the use of fasteners to press the heat absorbing plate onto the circuit board, so that the heat dissipation device contacts the electronic components, thereby achieving the heat dissipation requirement. [0003] Existing fasteners generally include screws, springs sleeved on the screws, and clasps buckled on the screws. When assembling, the screw of the buckle passes through the perforation of the radiator first, so that the spring is compressed and pressed against the upper surface of the radiator, and then the buckle is buckled on the end of the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
Inventor 利民符猛袁远
Owner CHAMP TECH OPTICAL FOSHAN