Solid-state imaging element and imaging device
A technology of solid-state imaging elements and light-gathering elements, which is applied in the direction of electric solid-state devices, electrical components, semiconductor devices, etc., and can solve problems such as reduced sensitivity, light deviation from light-receiving elements, and small incident angles
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no. 1 Embodiment approach )
[0039] figure 1 It is a diagram showing a schematic configuration of an imaging device (camera) according to a first embodiment of the present invention. figure 2 It is a diagram showing a detailed configuration of the solid-state imaging device 100 of the present embodiment.
[0040] This camera is composed of a solid-state imaging device 100 , a lens 110 , a DSP (Digital Signal Processing Circuit) 120 , an image display device 130 , and an image memory 140 .
[0041] In addition, in the digital single-lens reflex camera, the lens 110 is an interchangeable lens, and can be replaced with an optical lens having a different focal length. Specifically, the lens 110 is, for example, an imaging lens for wide-angle incident light, a long focal length lens, or an imaging lens corresponding to the telecentricity (the optical axis is almost parallel to the chief ray) entering the solid-state imaging device 100 .
[0042] In this camera, light enters from the outside through a lens ...
no. 2 Embodiment approach )
[0087] The difference between the solid-state imaging device of the second embodiment of the present invention and the first embodiment is that the lens in the layer is constituted by the light-condensing element 11, and the light-condensing element 11 composed of a plurality of concentrically structured light-transmitting films is assembled. Configured as an intralayer lens. Also, it is different from the first embodiment in that the microlenses are provided on the upper layer of the color filter 12 . Below, use Figure 8 as well as Figure 9 , the solid-state imaging device of this embodiment will be described focusing on points different from the first embodiment.
[0088] Figure 8 It is a cross-sectional view of the structure of the unit pixel 3 of the solid-state imaging device of this embodiment.
[0089] In this unit pixel 3 , the light-condensing element 11 is arranged on the lower layer of the color filter 12 , and the microlens 20 is arranged on the upper layer ...
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