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Adhesive tape joining method and adhesive tape joining apparatus

A sticking device and adhesive tape technology, which is applied in the manufacture of electrical components, semiconductor/solid-state devices, circuits, etc., can solve problems such as circuit damage and achieve the effect of suppressing deviations

Active Publication Date: 2014-03-26
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is a problem that circuits having bumps and the like are damaged when the load is increased

Method used

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  • Adhesive tape joining method and adhesive tape joining apparatus
  • Adhesive tape joining method and adhesive tape joining apparatus
  • Adhesive tape joining method and adhesive tape joining apparatus

Examples

Experimental program
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Embodiment Construction

[0052] In order to explain the invention, several embodiments considered to be suitable at present are shown in the drawings, but it is understood that the present invention is not limited to the structures and methods shown in the drawings.

[0053] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In addition, in this embodiment, the case where the adhesive tape for surface protection is attached to the circuit formation surface of a semiconductor wafer (it abbreviates as "wafer" hereafter) is demonstrated as an example.

[0054] figure 1 A front view showing the overall structure of an adhesive tape sticking device according to an embodiment of the present invention, figure 2 It is a plan view of the adhesive tape sticking device.

[0055] The adhesive tape sticking device includes a wafer supply / recovery unit 1, a wafer transport mechanism 2, an alignment table 3, a tape supply unit 4, a sticking unit 5, a tape cutting...

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PUM

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Abstract

The invention provides an adhesive tape joining method and an adhesive tape joining apparatus. An adhesive tape having a contour larger than that of paired covers used for constituting a chamber is joined onto a combining part which is used for combination of the paired covers and located on the lower cover in the paired covers. After the upper cover and the lower cover jointly clamp the adhesive tape and form the chamber, the adhesive tape is joined onto a wafer while the pressure of a space in one side of the wafer is made to be lower than that of a space in the other side of the wafer, the wafer being arranged in a manner that the wafer gets close to an adhesive surface of the adhesive tape and is opposite to the adhesive surface. A flat surface of a pressurizing member is used to pressurizing and thus flattening the surface, joined onto a circuit forming surface of the wafer, of the adhesive tape. The pressurizing treatment of the surface of the adhesive tape is selectively conducted based on the circuit state of the wafer and the characteristic of the adhesive tape.

Description

technical field [0001] The present invention relates to an adhesive tape application method and an adhesive tape application device. The adhesive tape includes a protective tape for protecting a circuit pattern formed on a semiconductor wafer, is attached to a ring frame, and is placed on the ring frame. A dicing tape that integrates the ring frame and the semiconductor wafer into one on the back surface of the semiconductor wafer in the center. Background technique [0002] Generally, circuit patterns of many elements are formed on the surface of a semiconductor wafer (hereinafter, appropriately referred to as a “wafer”). For example, bumps and fine circuits are formed on the wafer surface. Therefore, a protective tape is attached to protect the surface of the circuit. [0003] The same unevenness is also generated on the surface of the pasted protective tape due to the influence of unevenness such as bumps on the wafer surface. Therefore, after the sticking process of t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00H01L21/02
CPCH01L21/6836H01L21/566H01L21/67132
Inventor 金岛安治长谷幸敏村山拓山本雅之
Owner NITTO DENKO CORP