Silica gel for electronic components and preparation method thereof

A technology of electronic components and silicone gel, applied in the direction of adhesives, etc., can solve the problem of failure to solve the problem of silicone gel adhesion, toughness and strength, the inability to guarantee the toughness and strength of silicone gel, and the inability to guarantee the adhesion of electronic components Sex and other issues, to achieve the effect of increasing toughness, good adhesion, and improving strength

Active Publication Date: 2014-04-09
ZHENJIANG JIANGNAN CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The invention patent with the publication number CN102516775 discloses a high-adhesive silicone gel for potting precision electronic components. Hydrogen-containing silicone oil with low hydrogen content is used as the cross-linking agent to prepare a high-adhesive silicone gel. Silicone gel, but only by selecting low-hydrogen silicone oil can not guarantee that the silicone gel has good toughness and strength
The invention patent with the publication number CN102498174 selects terminal vinyl silicone oil and terminal or side chain hydrogen-containing silicone oil to prepare a silicone gel, but only by selecting terminal vinyl silicone oil cannot guarantee that the silicone gel has good adhesion to electronic components. Attachment
Patents CN102807757, CN101868220, CN101096565, CN102512339, etc. all involve the method of preparing silicone gel, but none of them can solve the problem of making silicone gel have good adhesion, toughness and strength at the same time

Method used

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  • Silica gel for electronic components and preparation method thereof
  • Silica gel for electronic components and preparation method thereof
  • Silica gel for electronic components and preparation method thereof

Examples

Experimental program
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preparation example Construction

[0033] The preparation method of the B component is:

[0034] According to [(Si-H) / (CH 2 =CH-Si)] mixed at a molar ratio of 0.2 to 0.6, then crosslinked under the action of a platinum catalyst, and distilled under reduced pressure at 180 to 200°C for 2 to 4 hours to obtain an intermediate;

[0035] Mixing the intermediate with side hydrogen-containing silicone oil and inhibitor to obtain component B;

[0036] The mass of the catalyst is 2-4‰ of the total mass of the A component and the B component;

[0037] The mass of the inhibitor is 2-3‰ of the total mass of components A and B;

[0038] The number of moles of Si-H bonds in terminal hydrogen-containing silicone oil and side hydrogen-containing silicone oil is related to [CH in terminal vinyl silicone oil and side vinyl silicone oil. 2 =CH-Si] bond molar ratio is less than 1.

[0039] In the present invention, the silica gel includes component A and component B, and the mass ratio of component A to component B is 1:1. Wh...

Embodiment 1

[0075] Preparation of component A: Accurately weigh 100 g of side vinyl silicone oil with a viscosity of 1000 mPa·s and 0.5 g of Pt-vinyl siloxane chelate with a concentration of 5000 ppm, mix them and stir evenly.

[0076]Preparation of component B: Accurately weigh 60g of vinyl-terminated silicone oil with a viscosity of 1500mPa s and 15g of 0.08% hydrogen-terminated silicone oil and mix them. (CH 2 =CH-Si)] in a molar ratio of 0.2:1; then lightly cross-linked under the action of a platinum catalyst, distilled under reduced pressure at 200°C for 2 hours, and finally added 25g of side hydrogen-containing silicone oil with a hydrogen content of 1.3%, methyl Butynol 0.5g. The number of moles of Si-H bonds in terminal hydrogen-containing silicone oil and side hydrogen-containing silicone oil and the CH in terminal vinyl silicone oil and side vinyl silicone oil 2 The molar ratio of =CH-Si bond is 0.4:1.

[0077] When in use, mix the prepared component A and component B uniform...

Embodiment 2

[0079] Preparation of component A: Accurately weigh 100 g of side vinyl silicone oil with a viscosity of 1000 mPa·s and 0.5 g of Pt-vinyl siloxane chelate with a concentration of 5000 ppm, mix them and stir evenly.

[0080] Preparation of component B: Accurately weigh 60g of vinyl-terminated silicone oil with a viscosity of 500mPa·s and 15g of 0.08% hydrogen-terminated silicone oil and mix them. CH 2 =CH-Si)] in a molar ratio of 0.6:1; then lightly crosslinked under the action of a platinum catalyst, distilled under reduced pressure at 200°C for 2 hours, and finally added 25g of side hydrogen-containing silicone oil with a hydrogen content of 0.9% and methyl Butynol 0.5g, mix and stir evenly.

[0081] The number of moles of Si-H bonds in terminal hydrogen-containing silicone oil and side hydrogen-containing silicone oil and the CH in terminal vinyl silicone oil and side vinyl silicone oil 2 The molar ratio of =CH-Si bond is 0.8:1.

[0082] When in use, mix the prepared comp...

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Abstract

The invention provides silica gel for electronic components. The silica gel is composed of an A component and a B component according to a mass ratio of 1:1, wherein the A component comprises vinyl branched silicon oil and a catalyst; the preparation method of the B component is as follows: mixing vinyl terminated silicone oil with hydrogen terminated silicon oil, and then, crosslinking under the action of a platinum catalyst to obtain an intermediate; mixing the intermediate and hydrogen branched silicon oil with an inhibitor to obtain the B component; the mass of the catalyst accounts for 2-4 per mill of total mass of the A component and the B component; the mass of the inhibitor accounts for 2-3per mill of total mass of the A component and the B component; the ratio of mole number of Si-H bonds in the hydrogen terminated silicon oil and the hydrogen branched silicon oil to the mole number of [CH2=CH-Si] bonds in the vinyl terminated silicone oil and the side vinyl silicone oil is smaller than 1. The silica gel provided by the invention simultaneously has good adhesion, toughness and strength.

Description

technical field [0001] The invention relates to the field of adhesives, in particular to silicone gel for electronic components and a preparation method thereof. Background technique [0002] Due to the needs of social development, electronic devices are becoming more and more complex, which requires that electronic components must have the characteristics of reliability, high speed, low energy consumption, light weight, and miniaturization. If you want electronic components to exert excellent comprehensive performance and maintain their good service life, they must be protected by potting to prevent them from being damaged by external conditions such as dust, moisture or severe vibration. Therefore, it is necessary to find suitable electronic components The ideal potting material is the key. [0003] Silicone gel is a liquid silicone rubber without filler, which can be divided into condensation type silicone gel and addition type silicone gel. Addition-type silicone gel h...

Claims

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Application Information

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IPC IPC(8): C09J183/07C09J183/05
Inventor 王伟王轲徐晓明陈丽云王成雷吴明强杨紫燕
Owner ZHENJIANG JIANGNAN CHEM
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