Mold for injection molding and injection molding method

Abstract

A mold for injection molding and an injection molding method, the upper mold (41) is composed of a first slug (3) and a plurality of second slugs (4), and a cylindrical heater (6) is arranged on the first slug (3) The boundary part with the second slug (4), and is held by the first slug (3) and the second slug (4), so that the direction from the cartridge heater (6) toward the second slug (4) ) is smaller than the heat conduction efficiency from the cylindrical heater (6) to the first slug (3), therefore, the performance of heating and cooling of the mold can be improved, even in continuous molding production with short molding intervals In this case, it is possible to provide a molded part in good condition without impairing the appearance quality of the exterior molded part.

Description

technical field [0001] The present invention relates to an injection mold used for molding a resin molded article and an injection molding method using the injection mold. Background technique [0002] At present, in the injection molding method of resin molded parts such as exterior molded parts, there is a method of disposing an electric heater near the cavity of the molded part of the mold, and raising the temperature near the molded part of the mold to the vitrification of the resin before the resin is injected. The method above the transition temperature (see Japanese Patent Laid-Open No. 2010-264703). By flowing the resin into the mold with the temperature of the mold raised, the curing of the resin that occurs when the resin comes into contact with the mold during the flow can be delayed, and transfer from the mold to the resin can be performed with high precision. Therefore, in addition to improving the glossiness of the molded part, the shape of the product and the...

AI Technical Summary

Problems solved by technology

In this way, since the heated insert rear member 52 is cooled, there are problems such as deterioration of cooling performance, occurrence of warping deformation and shrinkage cavities as described above.

In addition, since the cooling circuit 54 is disposed on the insert rear member 52, there is a problem that the temperature of the cooling circuit 54 itself rises to further degrade the cooling performance.

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