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Laser encapsulation method and display panel manufacturing method
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A display panel and laser encapsulation technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as easy cracking
Active Publication Date: 2016-09-14
BOE TECH GRP CO LTD
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Problems solved by technology
[0005] The technical problems to be solved by the present invention include, aiming at the problem that the existing glass substrates are prone to breakage when laser irradiation is used for packaging, and to provide a method that can effectively alleviate the cracking of the glass substrate during packaging by laser irradiation and exposure. Laser encapsulation method and display panel manufacturing method
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Embodiment 1
[0025] combine Figures 1 to 3 As shown, this embodiment provides a method for laser packaging, which specifically includes the following steps:
[0026] Step 1, placing the first substrate 2 on the platform 1 , and setting glass frit on the packaging area of the first substrate 2 . Wherein, the glass frit may be disposed in the encapsulation area of the first substrate by means of deposition, filling, spraying, etc., which is not limited herein.
[0027] Step 2, aligning the second substrate 3 with the first substrate 2 .
[0028] Step 3, preheating the first substrate 2 and the second substrate 3 that are opposite to each other.
[0029] Wherein, the platform 1 in this embodiment is preferably a heatable platform, and at this time, the first substrate 2 and the second substrate 3 that are in the box can be preheated through the heating platform. The heating platform is preferably a heating platform in a warm water circulation mode.
[0030] It should be noted that th...
Embodiment 2
[0035] combine Figures 1 to 3 As shown, this embodiment provides a method for preparing a display panel, which includes the method of laser encapsulation in Embodiment 1, and seals the first substrate 2 and the second substrate 3 that are mutually boxed to form a display panel mother board A step of.
[0036] The preparation method of the display panel in this embodiment specifically includes:
[0037] Step 1. Seal the first substrate 2 and the second substrate 3 of the box to each other by the laser encapsulation method in Embodiment 1, so as to form a display panel mother board.
[0038] Step 2, using the laser 4 to irradiate the mask plate 5 to expose the mother board of the display panel to form a pre-cut area.
[0039] Wherein, the mask plate 5 is preferably a heatable mask plate 5, usually the mask plate 5 is made of glass, and the heatable mask plate 5 can be realized by arranging heating wires 7 in the glass.
[0040] Preferably at this time, the said use of the la...
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Abstract
The invention provides a laser packaging method and a preparation method of a display panel, belonging to the technical field of display device manufacturing, which can solve the existing problem that the substrates are easily broken when laser irradiation is used to package two pairs of box substrates. The laser encapsulation method of the present invention includes placing the first substrate on a platform, and setting glass frit in the encapsulation area of the first substrate; aligning the second substrate with the first substrate; The substrate and the second substrate are preheated.
Description
technical field [0001] The invention belongs to the technical field of display device preparation, and in particular relates to a laser encapsulation method and a display panel preparation method. Background technique [0002] Organic light-emitting display (Organic Light-Emitting Diode; OLED) device, as a new type of flat-panel display, has received a lot of attention due to its characteristics of active light emission, high luminous brightness, wide viewing angle, fast response speed, low energy consumption and flexibility. More and more attention has become the next generation display technology that may replace liquid crystal display. [0003] Organic layer materials that are extremely sensitive to water vapor and oxygen exist in current OLED devices, which greatly reduces the lifetime of OLED devices. In order to solve this problem, in the prior art, various materials are mainly used to isolate the organic layer material of the OLED from the outside world, so that the ...
Claims
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Application Information
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