Wavelength division multiplexing type silicon substrate optical receiving chip insensitive to polarization

A polarization-insensitive, wavelength-division multiplexing technology, applied in the field of optical communication, to achieve the effect of flat spectral response, low wavelength dependence loss, and easy popularization and use

Active Publication Date: 2015-03-25
WUHAN POST & TELECOMM RES INST CO LTD
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  • Abstract
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Problems solved by technology

[0009] The technical problem to be solved by the present invention is to solve the problem that the existing polarization-independent scheme sacrifices performan...

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  • Wavelength division multiplexing type silicon substrate optical receiving chip insensitive to polarization

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Embodiment Construction

[0032] The present invention will be described in detail below in conjunction with the accompanying drawings.

[0033] Such as figure 1 As shown, the present invention provides a polarization-insensitive WDM silicon-based optical receiving chip, including a speckle converter 1, a polarization beam splitter 2, a polarization rotator 3, an optical equalizer, and two beam splitters and multiple photodetectors.

[0034] The mode spot converter 1 couples the optical signal in the optical fiber to the silicon-based light receiving chip.

[0035] The input end of the polarization beam splitter 2 is connected to the output end of the mode spot converter, and the polarization separation of the optical signal into mutually orthogonal transverse magnetic field TM mode polarized light and transverse electric field TE mode polarized light is respectively distributed to the first 1. In the second silicon waveguide.

[0036] The input end of the polarization rotator 3 is connected with th...

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Abstract

The invention discloses a wavelength division multiplexing type silicon substrate optical receiving chip insensitive to polarization. The optical receiving chip comprises a speckle convertor, a polarization beam splitter, two optical splitters and a plurality of photoelectric detectors. An optical signal in an optical fiber is coupled into the silicon substrate optical receiving chip by the speckle convertor, the optical signal is separated into TM model polarized light and TE model polarized light orthogonal with the TM model polarized light by the polarization beam splitter in a polarization mode, a TM model polarized light signal is converted into the TM model polarized light by a polarization rotator, the parts, with the same wavelength, in the optical signal in a first silicon waveguide and a second silicon waveguide are downloaded correspondingly through the first optical splitter and the second optical splitter respectively, and the two ends of each photoelectric detector correspond to one output end of the first optical splitter and one output end of the second optical splitter respectively. All the components on the silicon substrate optical receiving chip are small in size and low in optical insertion loss, and time domain synchronization and optical power balance are easy to achieve. Spectral response of all the components on the silicon substrate optical receiving chip is flat, the wavelength correlation loss is small, and the wavelength division multiplexing optical receiving function insensitive to polarization is achieved.

Description

technical field [0001] The invention relates to an optical device applied in the field of optical communication, in particular to a polarization-insensitive wavelength division multiplexing type silicon-based light receiving chip. Background technique [0002] Polarization insensitivity is a key performance of optical communication devices. The optical transceivers used in Ethernet, PON and data center systems are extremely sensitive to cost, and the package size is small, the number of use is large, and the perturbation of the optical fiber path is random, so this type of optical transceiver must meet the requirements of polarization insensitivity characteristics. [0003] Optical devices based on silicon-based optoelectronic integration technology have become the preferred solution for next-generation optical communication devices due to their low material cost, excellent optoelectronic performance, and fabrication process compatible with CMOS. At present, in order to ob...

Claims

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Application Information

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IPC IPC(8): G02B6/122G02B6/126G02B6/27
CPCG02B6/4213G02B6/43
Inventor 肖希陈代高王磊李淼峰邱英杨奇
Owner WUHAN POST & TELECOMM RES INST CO LTD
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