Product
Patsnap Eureka
For R&D, Patsnap Eureka makes reading and utilizing patents & technical documents easy.
Patsnap Eureka AIR
Designed for self-driven R&D workflows. Generate viable solutions, solve complex R&D challenges, empower your innovation with AI.
Patsnap Eureka Materials
Designed for material experts only. Revolutionize your material R&D, from search, analyze, to developing new materials.
Feature
TechResearch
Generate reliable direction feasibility study reports for your R&D in just a few steps.
TechSeek
Discover and master advanced knowledge NOW. Basics, ideas, possibilities, all at once.
TechMind
As an expert in R&D Theories, TechMind can generates customized viable solutions instantly.
TechRisk
Analyze your overall solution with one click, know your potential R&D risks in advance.
TechMonitor
Get weekly tech updates, stay abreast of the latest tech innovations and key insights.
Patents
Literature
Hiro is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
58results about How to "Low process precision requirements" patented technology
Efficacy Topic
Property
Owner
Technical Advancement
Application Domain
Technology Topic
Technology Field Word
Patent Country/Region
Patent Type
Patent Status
Application Year
Inventor
Wavelength division multiplexing type silicon substrate optical receiving chip insensitive to polarization
ActiveCN104459881AFlat spectral responseLow wavelength dependent lossCoupling light guidesSpectral responseOpto electronic
The invention discloses a wavelength division multiplexing type silicon substrate optical receiving chip insensitive to polarization. The optical receiving chip comprises a speckle convertor, a polarization beam splitter, two optical splitters and a plurality of photoelectric detectors. An optical signal in an optical fiber is coupled into the silicon substrate optical receiving chip by the speckle convertor, the optical signal is separated into TM model polarized light and TE model polarized light orthogonal with the TM model polarized light by the polarization beam splitter in a polarization mode, a TM model polarized light signal is converted into the TM model polarized light by a polarization rotator, the parts, with the same wavelength, in the optical signal in a first silicon waveguide and a second silicon waveguide are downloaded correspondingly through the first optical splitter and the second optical splitter respectively, and the two ends of each photoelectric detector correspond to one output end of the first optical splitter and one output end of the second optical splitter respectively. All the components on the silicon substrate optical receiving chip are small in size and low in optical insertion loss, and time domain synchronization and optical power balance are easy to achieve. Spectral response of all the components on the silicon substrate optical receiving chip is flat, the wavelength correlation loss is small, and the wavelength division multiplexing optical receiving function insensitive to polarization is achieved.
Owner:WUHAN POST & TELECOMM RES INST CO LTD
Multi-core optical fiber coupler and preparation method thereof
ActiveCN109239845AEasy to makeHigh precisionCoupling light guidesEngineeringFiber-optic communication
The invention belongs to the technical field of optical fiber communication and sensing, and particularly relates to a multi-core optical fiber coupler and a preparation method thereof. The preparation method comprises the steps of inserting a plurality of single-mode optical fibers of which a coating layer on each front end is removed and a coating layer on each rear end is still kept into a circular sleeve subject to a first time of tapering; then, performing a second time of tapering at a same position so that the single-mode optical fibers are fixed by the circular sleeve; next, performinga third time of tapering on a tapered area subject to the second time of tapering so that a tapered waist portion and a multi-core optical fiber cladding are consistent in diameter, and cutting the tapered waist portion; and at last, directly welding with a multi-core optical fiber by fusion, thereby completing the preparation of the multi-core coupler. The preparation method of the multi-core optical fiber coupler based on a low melting point sleeve provided by the invention has the characteristics of good expandability, simple preparation, high precision and high finished product ratio.
Owner:HUAZHONG UNIV OF SCI & TECH
Silicon-based WDM optical transceiver module
InactiveCN106646783AAvoid difficultiesReduce in quantityCoupling light guidesTransceiverOptical Module
The invention provides a silicon-based WDM optical transceiver module comprising a silicon photonic chip including a modulator array and a detector array; and a wavelength division multiplexer and a demultiplexer achieved based on a planar lightwave circuit (PLC). The wavelength division multiplexer and the modulator array are connected through packaging. The demultiplexer is connected to the detector array connected through packaging. A WDM optical module is achieved by packaging the wavelength division multiplexer chip and the demultiplexer chip through the silicon photonic chip and the PLC so as to avoid process difficulty of the silicon-based wavelength division multiplexer / demultiplexer. In view of low integration and high power consumption of a traditional WDM optical transceiver module based on discrete devices and PLC, the modulator array and the detector array are integrated by using silicon photon technology so as to greatly improve the integration of optical transceiver module and to reduce power consumption.
Owner:SHANGHAI INT MICRO TECH AFFILIATION CENT +2
Dual-camera calibration method, device, system and mobile terminal
InactiveCN107958469ALow process precision requirementsEasy to makeImage analysisElectrical and Electronics engineeringImaging data
The embodiment of the invention provides a dual-camera calibration method, a device, a system and a mobile terminal; the method comprises the following steps: sending a control order to a robot arm soas to drive the robot arm to carry a calibration board to rotate for many angles, wherein the calibration board has a calibration pattern; invoking the dual-camera to gather multi-image data pieces of the calibration board under many angles; measuring a plurality of position information pieces of the calibration pattern in the plurality of image data pieces according to the color distribution information; calibrating the inner and outer parameters of the dual-camera according to the plurality of position information pieces. The calibration board employs a two-dimensional plate, is low in technical precision, and simple to make; the system formed by the calibration board and the robot arm is simple to operate, low in cost, and suitable for applications on industrial streamlines.
Owner:BEIJING ANYUNSHIJI TECH CO LTD
Display panel, display method, display device and color rendition method thereof
InactiveCN101872579AChange widthControl wavelengthStatic indicating devicesIdentification meansDisplay deviceTransmittance
The invention provides a display panel, which comprises a base plate. The base plate has a first reflecting layer and a second reflecting layer with specific light transmittance. The first reflecting layer comprises a reflecting unit array. Each reflecting unit comprises a reflecting plate which can continuously move along a direction perpendicular to the first reflecting layer, and a supporting beam connected with the reflecting plate and a connecting part. The invention additionally provides a display method, a display device and a color rendition method thereof. The display panel synthesizes color through time sequence color without distinguishing pixel color, the manufacturing process is only one third of the manufacturing process of a traditional display panel manufacturing method, the structure is simple and the manufacturing cost is low. The display device can compensate color drift caused by manufacturing error, the task of accurately realizing color rendition is transferred to the peripheral circuit of the display panel from the manufacturing process, and thereby the requirement on the precision of the manufacturing process is reduced.
Owner:季中
A device and a method for backtracking a terahertz communication beam based on double conjugate mixing
ActiveCN108988914AHigh communication rateLow process precision requirementsTransmitters monitoringReceivers monitoringEngineeringRelative motion
The invention relates to a terahertz communication beam backtracking device and method based on double conjugate mixing, For intersatellite links, because of the high relative motion of satellites, constrained by space-time conditions, so that the inter-satellite link has a short communication time, the transmission data volume is big. The terahertz wave of the invention can transmit a large amount of information in a short time because of the high transmission rate, and the alignment process does not require the physical alignment of mechanical conditions, and the transmission beam can be induced to transmit backward only by the incidence of the pilot wave, thus realizing the real-time alignment of the communication process and ensuring the sustainability of the communication. The invention can make the indirect connection of the terahertz communication node relatively easy, and the system does not need to adopt the terahertz frequency band rotary joint or the fast numerical controlphase shifter and the like to obtain the difficult component, and the problem of the terahertz beam tracking difficulty can be solved.
Owner:XIAN INSTITUE OF SPACE RADIO TECH
Optical interface device of optical demultiplexer/multiplexer for high-speed optical module
ActiveCN106788754AImprove reliabilityAvoid damageWavelength-division multiplex systemsElectromagnetic transceiversSignal onEngineering
The invention relates to an optical interface device of an optical demultiplexer / multiplexer for a high-speed optical module. The optical interface device comprises a packaging shell, an external optical interface unit, two internal interface units and a demultiplexing / multiplexing optical unit. The external optical interface unit is mounted at an optical fiber interface position of the high-speed optical module and is used for accessing a connection optical fiber. The internal interface units are connected with an optical transceiving assembly. The demultiplexing / multiplexing optical unit in the packaging shell is used for demultiplexing / multiplexing optical signals on an optical fiber link. The device provided by the invention is used at the optical interface position of the high-speed optical module, and the optical fiber link out of the module and the optical transceiving assembly in the module can be connected easily. The device is small in structure, thereby facilitating miniaturization of the module. In the manufacturing and assembling process of the high-speed optical module, through adoption of the device provided by the invention, the high-speed optical module can be mounted and adjusted rapidly, and the assembling and debugging process is simple and rapid. No optical fiber is coiled in the module, so the optical fiber is prevented from being damaged or broken and the reliability of the module is improved, thereby facilitating the mounting and manufacturing of the high-speed optical module.
Owner:GUANGXUN SCI & TECH WUHAN
IGBT (Insulated Gate Bipolar Transistor) chip manufacturing method for crimped type package
ActiveCN104810283AGood effectLow costTransistorSemiconductor/solid-state device manufacturingEngineeringPolysilicon gate
The invention relates to an IGBT (Insulated Gate Bipolar Transistor) chip manufacturing method for crimped type package. The IGBT chip manufacturing method comprises the following steps: selecting a silicon substrate and preprocessing the silicon substrate; carrying out field oxide layer growth on the surface of the silicon substrate, and etching the field oxide layer; manufacturing a gate oxide layer and a polysilicon gate electrode; manufacturing a P well and an N well; manufacturing Spacer, a P+ type doping region and an N+ type doping region; forming a positive electrode EM2 above the polysilicon gate electrode; forming a positive electrode EM1 on the outer side of the positive electrode EM2; forming a P+ collector region on the back surface of the silicon substrate; manufacturing a back electrode C. According to the technical scheme provided by the invention, the IGBT chip manufacturing method has low requirement on technological precision, and the tape-out cost is reduced.
Owner:GLOBAL ENERGY INTERCONNECTION RES INST CO LTD +1
A preparation method of multi-core fiber coupler based on tapered self-assembly
ActiveCN105785511BImprove scalabilityLow process precision requirementsCoupling light guidesFiber bundleEngineering
The invention discloses a method for preparing a multi-core optical fiber coupler based on tapering self-assembly. The method comprises following steps: single mode fiber pretreatment, single mode fiber bundle end preparation, glass bushing tapering, and glass bushing cutting and welding; inserting single mode fiber into the glass bushings entirely, wherein the front ends of the single mode fiber are corroded but the rear ends are still coated with coating; then placing the glass bushing vertically and tapering the glass bushing by use of oxyhydrogen flame, wherein the tapering position is the part which is corroded of the single mode fiber; then cutting and polishing the tapered zones; finally, welding the glass bushing with multi-core optical fiber to complete the preparation of the multi-core optical fiber coupler. The provided method for preparing the multi-core optical fiber coupler based on tapering self-assembly has good scalability and high yield rate, concise process and simple operation.
Owner:HUAZHONG UNIV OF SCI & TECH
Waveguide phase shifter and preparation method thereof
Embodiments of the invention provide a waveguide phase shifter and a preparation method thereof. The waveguide phase shifter comprises a semiconductor substrate comprising at least a substrate layer,an oxide layer, and a top silicon layer. The oxide layer is located between the substrate layer and the top silicon layer. A waveguide array is etched the on the top silicon layer. The waveguide arrayis at least one horizontally arranged ridge waveguide, and at least one highly doped region corresponding to the ridge waveguide is formed by ion implantation at a horizontal position of the top silicon layer close to the ridge waveguide. A first metal electrode for connecting power source anode and a second metal electrode for connecting power source cathode are respectively formed on upper surfaces at both ends of each highly doped region. The waveguide phase shifter provided by the embodiments of the invention provides a heated highly doped region on the side of the ridge waveguide, thereby realizing phase modulation of light wave passing through the ridge waveguide, which improves the heating efficiency of the ridge waveguide and improves the adjustment range of the phase.
Owner:BEIJING WANJI TECH
Dynamic powder paving system for additive manufacturing
ActiveCN109604596AMiniaturizationReduce dosageAdditive manufacturing apparatusIncreasing energy efficiencyLaser processingMetallurgy
The invention provides a dynamic powder paving system for additive manufacturing. A powder feeding and paving device can be miniaturized and power can be supplied quantitatively as needed. The dynamicpowder paving system for additive manufacturing comprises a powder cylinder, a powder feeding pipeline, a powder paving device, a local powder bed protecting hood and a guiding movement mechanism. The section contour of the powder cylinder is matched with the maximum section contour dimension of a needed formed part, and a powder paving area is formed between the first side wall and the second side wall of the powder cylinder; the lower end surface of the local powder bed protecting hood is empty, and the width of the local powder bed protecting hood is greater than the gap between the firstside wall and the second side wall; a buffer cabin of the powder paving device is fixed to the front side surface of the local powder bed protecting hood and is close to the lower end surface; and theguiding movement mechanism is used for driving the local powder bed protecting hood and the powder paving device to move synchronously to a next local powder paving area according to a preset track after local powder paving corresponding to the local powder bed protecting hood and laser processing of the local powder paving area is finished in light of a process command.
Owner:NAT INST CORP OF ADDITIVE MFG XIAN
Multi-core planar optical waveguide structure and coupling structure thereof
ActiveCN105759373ALow process precision requirementsImprove alignment toleranceCoupling light guidesDirect couplingSilicon dioxide
The invention relates to the technical field of optical waveguide coupling and provides a multi-core planar optical waveguide structure and a coupling structure thereof. The multi-core planar optical waveguide structure comprises a main silicon dioxide waveguide for transmitting optical signals and an auxiliary waveguide for assisting light incidence, wherein the auxiliary waveguide comprises one or more auxiliary silicon dioxide waveguide bodies, and the auxiliary silicon dioxide waveguide bodies and the main silicon dioxide waveguide are arranged according to present central distances. The planar optical waveguide structure including one or more auxiliary silicon dioxide waveguide bodies can complete passive light alignment and direct coupling from a laser device to a PLC. Compared with the prior art, the alignment tolerance can be improved. Based on the improvement of the alignment tolerance, the requirement for process precision in an automatic device can be further reduced, the time for light alignment and welding can be shortened, the defective percentage is further reduced, and accordingly the purpose of reducing the costs is achieved.
Owner:WUHAN TELECOMM DEVICES
Automatic quick accurate positioning device and method for optical disk cartridge of optical disc juke-box
ActiveCN104200821APrecise positioningHigh speedRecord information storageManipulatorElectrical and Electronics engineering
The invention discloses an automatic quick accurate positioning device for an optical disk cartridge of an optical disc juke-box. The device comprises a manipulator, an actuating unit, horizontal slide rails and vertical slide rails and further comprises two home positioning correlation sensors and a horizontal blocking piece and a vertical blocking piece, wherein the horizontal blocking piece and the blocking piece are matched with the two home positioning correlation sensors and used for limiting a home position. The manipulator is provided with a reflective sensor, and the reflective sensor can move vertically or move horizontally in the direction parallel to the side of an opening of the optical disk juke-box with the manipulator for vertically and horizontally scanning the optical disk cartridge for further achieving accurate positioning in a coordinate system with the home position serving as the origin of the coordinate and a detection opening as a center point. The automatic quick accurate positioning device for the optical disk cartridge of the optical disc juke-box uses the relative position for the positioning, omits manual intervention for debugging and repeatedly drawing for adjusting the position of the optical disk cartridge, and has the advantages of saving the positioning time and improving the accuracy of the positioning.
Owner:SUZHOU NETZON INFORMATION STORAGE TECH
Step type vertical gate NAND and forming method thereof
ActiveCN104392997AReduce process stepsLow process precision requirementsSolid-state devicesSemiconductor/solid-state device manufacturingSilicon nitrideEngineering
The invention discloses a step type vertical gate NAND with the advantages such as relatively high storage density, great development in the horizontal direction and the vertical direction. A forming method of the step type vertical grid NAND comprises the following steps of: providing a substrate, forming a bottom isolating layer, and alternatively depositing a multi-layer silicon layer and a multi-layer interlayer isolating layer; etching grooves to form a plurality of bar-shaped stacking structures, wherein each bar-shaped stacking structure is divided into a storage tube zone, a source end selecting tube zone and a tail end selecting tube zone; depositing an oxidized insulating medium on the lateral surface of each bar-shaped stacking structure, and then thinning the oxidized insulating medium of the storage tube zone; continuously depositing a silicon nitride layer and a silicon dioxide layer on the lateral surface of the storage tube region in sequence; depositing a gate electrode material and etching to form a storage tube grid electrode, a source end selecting tube grid electrode and a tail end selecting tube grid electrode; forming an apparatus source end in the source end selecting tube zone; etching step in the tail end selecting tube region to expose each silicon layer; and forming an electrode to complete electrical connection.
Owner:TSINGHUA UNIV +1
3D (three-dimensional) display device and system
InactiveCN102759805ASimple production processLow process precision requirementsStatic indicating devicesNon-linear optics3d imageImage resolution
The invention discloses a 3D (three-dimensional) display device and system, and relates to the technical field of 3D display. A liquid crystal display comprises a display panel, wherein the display panel comprises an array substrate, a color-film substrate, and liquid crystals, the color-film substrate is opposite to the array substrate, and the liquid crystals are filled between the array substrate and the color-film substrate. The 3D display device controls liquid-crystal molecules to rotate by virtue of a driving voltage; in a display period of a 3D image, the 3D display device drives the liquid crystal molecules to be deflected to a first angle during left-eye image display so that the polarization direction of linear polarized light emitted from the array substrate rotates to be the first angle, and also drives the liquid crystal molecules to be deflected to a second angle during right-eye image display so that the polarization direction of linear polarized light emitted from the array substrate rotates to be the second angle, and a differential value is configured between the first angle and the second angle. The 3D display device and system provided by the invention have the advantages of simple production process, low process precision requirement, reduced cost and improved display resolution.
Owner:BOE TECH GRP CO LTD +1
Self-aligning preparation method for horizontal total-restriction phase change memory based on corrosion
InactiveCN105070827ALow process precision requirementsEasy to operateElectrical apparatusElectric heatingCorrosion
The invention provides a self-aligning preparation method for a horizontal total-restriction phase change memory based on corrosion. The self-aligning preparation method comprises the steps of growing a first electrothermal insulating material layer on a substrate, performing spin coating and photoetching for forming a longitudinal first mask layer; depositing a first functional material layer on the first electrothermal insulating material layer and forming a first functional material layer slit; preparing a phase change material layer on the first functional material layer; performing annealing and corrosion for removing the phase change material layer, thereby forming a phase change material layer nano wire; performing photoetching for forming a phase change material quantum dot which horizontally opposes an electrode layer and is localized; removing a second mask layer and depositing a second electrothermal insulating layer; removing a third mask layer; depositing a third electrothermal insulating material layer; performing photoetching for forming a fourth mask layer, performing corrosion and film deposition for forming a second functional material layer, and performing peeling for forming a testing electrode, thereby finishing device preparation. The self-aligning preparation method has advantages of low requirement for a technological precision, simple preparation, high reliability, high preparation yield, low research and development cost, and high economic performance.
Owner:INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
Flexible organic flat panel ultraviolet light source and preparation method thereof
ActiveCN103681211AConcise and reliable structure and preparation processLow process precision requirementsElectric discharge lampsCold cathode manufactureWave bandLight source
A flexible flat panel ultraviolet light source includes a multilayer structure which is formed by an ultraviolet high-permeability organic polymer and an ultra-thin glass; the multilayer structure includes a front substrate, a back substrate, and an organic cavity layer positioned between the front substrate and the back substrate; edges around the front substrate, around the back substrate, and around the organic cavity layer are sealed; the front substrate is composed of the ultra-thin glass with the thickness of 30 to 100 mu m, the organic polymers with the thickness of 0.1 to 1 mm, and an electrode on the ultra-thin glass; the back substrate comprises the ultra-thin glass, the organic polymer, and a selective fluorescent powder coating layer on the ultra-thin glass; and the organic cavity layer positioned between the front substrate and the back substrate has the thickness of 10 mu m to 1 mm, and is internally provided with a discharge space which is formed by a cavity or passage with the width of 10 mu m to 5 mm. In the invention, the light source of the UVA, UVB, and UVC band radiation can be sent, and the air tightness and service life of the pure organic material device are increased.
Owner:南京新港科技产业服务有限公司
Composite butterfly check valve
The invention discloses a composite butterfly check valve. The composite butterfly check valve comprises a valve body provided with a valve element runner, and a valve rod; a valve element assembly ismounted in the valve element runner; the valve element assembly comprises a check plate, a butterfly plate, a through hole, a limiting shaft and a return spring, wherein the check plate is hinged into the valve element runner and used for closing or opening an inlet; the check plate is provided with a valve hole; the butterfly plate is rotationally arranged in the valve hole through a second rotating shaft; a blind hole is formed in the upper part of the butterfly plate; a blind hole guide groove is formed in the hole wall of the blind hole; the through hole is vertically formed in the upperpart of the check plate; a through hole guide groove is formed in the hole wall of the through hole; the limiting shaft is inserted in the blind hole; a limiting shaft guide block is convexly arrangedon the peripheral wall of the limiting shaft; the return spring is mounted in the blind hole; the limiting shaft is provided with a limiting hole for inserting in a driving end; and the valve rod andthe valve body are in sliding and rotating tight fit. The composite butterfly check valve achieves the functions of a check valve and a butterfly valve to widen the application working conditions; and due to reasonable structure and reduction of the loss, the service life of the valve is prolonged.
Owner:杭州潮响信息技术有限公司
1*N demultiplexer/multiplexer optimization method
ActiveCN106599465AAvoid poor optimization resultsImprove performanceDesign optimisation/simulationSpecial data processing applicationsSize parameterMesh grid
The invention discloses a 1*N demultiplexer / multiplexer optimization method. The 1*N demultiplexer / multiplexer optimization method comprises the following steps: step 1, determining a performance requirement, a dimensional requirement and a process condition of a 1*N demultiplexer / multiplexer; step 2, carrying out mode analysis by employing a finite element method, determining widths of input and output waveguides, and an initial width of a rectangular coupling area, and selecting a shape and a dimension of an available etching element from a geometric library; step 3, determining optimization dimension parameters and optimization times of the rectangular coupling area, respectively carrying out optimization on the rectangular coupling area under the optimization dimension parameters, then calculating a value of a spectrum objective function, and taking the optimization dimension parameter with the least spectrum objective function value as the dimension parameter of the rectangular coupling area; and step 4, according to the shape and the dimension of the available etching element, dividing the rectangular coupling area into a plurality of square grids, determining a processing scheme of each square grid on the rectangular coupling area according to a manner of being from left to right and from middle to two sides, and at last determining a geometric structure of the rectangular coupling area.
Owner:SOUTHEAST UNIV
Re-wiring layer structure and preparation method thereof, and packaging structure and preparation method thereof
ActiveCN113327911ASame distanceSimple structureSemiconductor/solid-state device detailsSolid-state devicesStructural engineeringMechanical engineering
The invention provides a re-wiring layer structure and a preparation method thereof, and a packaging structure and a preparation method thereof. The re-wiring layer structure is arranged between two adjacent chips, and the re-wiring layer structure comprises a signal connector (a first connector) used for realizing signal connection between the chips, and power supply connecting pieces (a second connecting piece, a third connecting piece and a fourth connecting piece) used for realizing power supply connection between the chips and an external power supply. The power supply connecting pieces are arranged in the same rewiring layer structure (arranged in the same intermediate layer), so that an existing structure in which a power supply board is separated from the intermediate layer is replaced. The structures are simple, the distance between the signal connecting piece and the substrate and the distance between the power connecting piece and the substrate are consistent, the connecting structure is simple, the process precision requirement is low, the process is simple, and the yield is greatly improved.
Owner:ZHEJIANG NANOMICRO TECH CO LTD +1
Reconfigurable integrated microwave photonic band-pass filter
ActiveCN113691315ASave bandwidthIncreased bandwidth adjustment rangeDistortion/dispersion eliminationOptical light guidesOptical couplerRadio frequency
The invention discloses a reconfigurable integrated microwave photon band-pass filter, and belongs to the field of microwave photon signal processing. The reconfigurable integrated microwave photon band-pass filter comprises a semiconductor laser for outputting a continuous optical carrier signal; an optical beam splitter is used for splitting the continuous optical carrier signal into two paths of light beams; a microwave optical signal generation module is used for generating a microwave modulation signal and modulating the microwave modulation signal and one path of light beam output by the optical beam splitter to generate a microwave optical signal; a multi-stage cascaded second-order micro-ring filter is integrated, and bandwidth reconstruction and rejection ratio and center frequency tuning are carried out on the generated microwave optical signal; an optical coupler is used for combining the microwave optical signal with the other path of light beam output by the optical beam splitter; a microwave electric signal receiving module is used for converting the combined microwave optical signal into an electric signal and receiving the microwave electric signal. According to the invention, narrow-band filtering can be realized on the basis of a high radio frequency out-of-band rejection ratio, and bandwidth reconstruction of a microwave optical signal in a wide range and flexible tuning of a center frequency are realized.
Owner:HUAZHONG UNIV OF SCI & TECH
A kind of multi-core optical fiber coupler and preparation method thereof
ActiveCN109239845BEasy to makeHigh precisionCoupling light guidesEngineeringFiber-optic communication
Owner:HUAZHONG UNIV OF SCI & TECH
Manufacturing method of semiconductor structure, and semiconductor structure
PendingCN113707566AAvoid misalignmentGuaranteed electrical connection performanceSemiconductor/solid-state device detailsSolid-state devicesSemiconductor structureElectrical connection
The invention provides a manufacturing method of a semiconductor structure, and the semiconductor structure. The manufacturing method comprises the steps that a to-be-wired structure is provided, wherein the to-be-wired structure comprises at least one chip, the chip is provided with a front face, and the front face of the chip is provided with a plurality of welding pads; a first insulating layer is formed on the front face of the chip, the first insulating layer is provided with a plurality of openings, and each opening exposes at least part of one welding pad; a conductive film layer is formed on the side, deviating from the chip, of the first insulating layer, the conductive film layer covers the surface, deviating from the chip, of the first insulating layer and the part, exposed by the opening, of the welding pad, and the thickness of the part, located on the side, deviating from the chip, of the conductive film layer is smaller than that of the part, covering the welding pad, of the conductive film layer; the part, exceeding the first insulating layer, of the conductive film layer is removed to obtain a conductive structure which is located in the opening and is in direct contact with the welding pad; and a re-wiring structure is formed on one side, deviating from the chip, of the first insulating layer, and the re-wiring structure is electrically connected with the conductive structure.
Owner:SIPLP MICROELECTRONICS CHONGQING CO LTD
Electromagnetic clutch and clutch assembly
PendingCN111473063ALow process precision requirementsReduce energy consumptionCoolant flow controlMagnetically actuated clutchesElectromagnetic clutchFriction force
The invention discloses an electromagnetic clutch and a clutch assembly, and relates to the technical field of clutches. The electromagnetic clutch comprises a driving rotating clutch part, a driven rotating clutch part, a clutch bearing, an electrifying coil, an armature and a clamping piece, wherein the driving rotating clutch part and the driven rotating clutch part are rotatably arranged alonga first rotating center shaft; the clutch bearing is arranged between the driving rotating clutch part and the driven rotating clutch part, and a gap is formed between the driving rotating clutch part and the driven rotating clutch part; and the armature is rotatably arranged around the first rotating center shaft, and the clamping piece is arranged in the gap and is fixedly connected with the armature. According to the electromagnetic clutch and the clutch assembly, when the electrifying coil is not electrified, the upper end surface of the armature is pressed on the driving rotating clutchpart, the clamping piece is clamped in the gap, and the driving rotating clutch part, the driven rotating clutch part, the clamping piece and the armature synchronously rotate; and when the electrifying coil is electrified, the electrifying coil attracts the armature to move, the armature and the electrifying coil are attracted, meanwhile, the friction force between the clamping piece and the driving rotating clutch part is reduced, and the armature, the clamping piece and the driven rotating clutch part stop rotating.
Owner:QINGDAO DELIFENG MACHINERY
Method and equipment for transferring light-emitting particles, display substrate and device
ActiveCN110120445ATransfer method is easy to implementEasy to mass produceSemiconductor devicesEngineeringLight-emitting diode
The invention provides a method and equipment for transferring light-emitting particles, a display substrate and a device. The transferring method comprises the following steps: providing a substratewith an inorganic light-emitting material sheet; cutting the inorganic light-emitting material sheet to form a plurality of light-emitting particles; heating the substrate on which the light-emittingparticles are formed, and expanding the substrate after heating to separate the plurality of light-emitting particles by a predetermined distance; aligning and laminating the substrate on which the separated light-emitting particles are formed with a driving back plate, and transferring the light-emitting particles to the driving back plate, wherein the driving back plate comprises a plurality ofpixel circuits which are in one-to-one correspondence with the light-emitting particles; and removing the substrate. The method is easy to implement, the light-emitting particles and the positions ofthe pixel circuits on the driving back plate can be ensured to be in one-to-one correspondence, the operability is high, and the mass production of the inorganic light-emitting diode display substrateis facilitated.
Owner:BOE TECH GRP CO LTD +1
Semiconductor LED and its preparing process
InactiveCN1157805CHigh luminous intensityImprove featuresSemiconductor devicesLuminous intensityLight-emitting diode
A semiconductor LED is composed of ordinary LED chip, disk type mesa basic luminous cavity, microstructure and electrodes. A 2D periodical microstructure is etched on the top of mesa P-type metal electrode by photoetching and dry etching or FIB techniques. Said period is sub-micron or micron class. Its advantage is high light intensity increased by 1.6-8 time. It is suitable for blue or green InGaN-base quantum trap LEDs.
Owner:DONGGUAN INST OF OPTO ELECTRONICS PEKING UNIV
OLED (organic light-emitting diode) and light-emitting device
ActiveCN108538894AMeet color temperature requirementsImprove efficiencySolid-state devicesSemiconductor/solid-state device manufacturingCharge carrierOrganic light emitting device
Owner:BOE TECH GRP CO LTD
nearline optical library
ActiveCN104200822BImprove storage densityEasy to achieve loadingRecord information storageCompact discLocking mechanism
The invention discloses a near-line optical disc library, which comprises a cabinet; two disc magazine rows arranged oppositely and at intervals in the cabinet, and each disc magazine row contains a plurality of stacked disc magazines; The manipulator assembly between the magazine rows, the manipulator assembly is used to operate the disc magazines in the disc magazine bins on both sides; The side opening is accessed, and the storage compartment is provided with a disc case locking mechanism for locking the disc case. The near-line optical disk library of the present invention can significantly improve the storage density of optical disks and the overall space utilization rate of the optical disk library by adopting the oppositely arranged rows of optical disk magazines and the manipulator assembly therebetween, and the optical disk magazine is provided with a locking mechanism for optical disk , can improve the security of the optical disc library, and the automatic fast and precise positioning method of the present invention can improve the calibration accuracy of the optical disc library.
Owner:SUZHOU NETZON INFORMATION STORAGE TECH
A multi-core planar optical waveguide structure and its coupling structure
ActiveCN105759373BLow process precision requirementsImprove alignment toleranceCoupling light guidesDirect couplingOptoelectronics
The invention relates to the technical field of optical waveguide coupling and provides a multi-core planar optical waveguide structure and a coupling structure thereof. The multi-core planar optical waveguide structure comprises a main silicon dioxide waveguide for transmitting optical signals and an auxiliary waveguide for assisting light incidence, wherein the auxiliary waveguide comprises one or more auxiliary silicon dioxide waveguide bodies, and the auxiliary silicon dioxide waveguide bodies and the main silicon dioxide waveguide are arranged according to present central distances. The planar optical waveguide structure including one or more auxiliary silicon dioxide waveguide bodies can complete passive light alignment and direct coupling from a laser device to a PLC. Compared with the prior art, the alignment tolerance can be improved. Based on the improvement of the alignment tolerance, the requirement for process precision in an automatic device can be further reduced, the time for light alignment and welding can be shortened, the defective percentage is further reduced, and accordingly the purpose of reducing the costs is achieved.
Owner:WUHAN TELECOMM DEVICES
Who we serve
- R&D Engineer
- R&D Manager
- IP Professional
Why Patsnap Eureka
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com