1results about How to "Improve alignment tolerance" patented technology

This invention discloses a method for optical interconnection of silicon photonic chips based on meniscus-guided additive manufacturing, belonging to the field of silicon photonic chips. The method includes: in a controlled gas environment, using a printing material system containing polymers and organic solvents, stretching a liquid bridge between the optical interfaces of two silicon photonic chips using microneedles, and guiding the movement of the meniscus to form a polymer filament connecting the two ends. Subsequently, the solvent evaporates and solidifies, ultimately forming a free-space polymer optical waveguide spanning the chips. This method does not rely on high-energy lasers or adhesive application and washing processes, and is simple, low-cost, and highly efficient. The fabricated waveguides can achieve controllable spans from hundreds of nanometers to hundreds of micrometers in diameter and tens of micrometers to millimeters in length. The end faces can be optimized into controllable transition structures, effectively improving mode matching and coupling efficiency. It features low insertion loss, high alignment tolerance, and good mechanical stability, making it suitable for high-density silicon photonic packaging and heterogeneous integration.