The utility model belongs to the technical field of
semiconductor production, and discloses a
temperature control device for
semiconductor production. Comprising a
temperature control box, a mounting hole is formed in one end of the
temperature control box, a cover plate is mounted in the mounting hole through bolts, and a temperature sensor is mounted at one end of the cover plate; heat dissipation nets are embedded in the two sides of the temperature control box, a water tank is installed at the bottom of the other end of the temperature control box, a connecting box is installed at the top of the other end of the temperature control box, a water pump is installed at one end of the water tank, and a circulating
pipe is installed at the output end of the water pump. When the external environment temperature drops suddenly, the telescopic rubber
pipe is in an unfolded state to close the heat dissipation net, the heat preservation effect is achieved, the equipment is prevented from being affected by the external environment, the equipment is cooled through matched use of the water tank, the water pump, the circulating
pipe, the connecting box and the connecting pipe in the heat dissipation process, and the reciprocating mechanism is additionally arranged; when the cooling liquid flows, the telescopic rubber pipe is driven by the reciprocating mechanism to be folded and stored, so that the heat dissipation net is opened, and the heat dissipation effect is improved.