The invention relates to a full-automatic
wafer dicing saw
control system based on vision. The full-automatic
wafer dicing saw
control system based on the vision is matched with a tool device, an optical
maser and a micro-camera. Hardware comprises a computer, a
motion control card and a displayer, wherein the
control card, the displayer, the optical
maser and the micro-camera are respectively connected with the computer, motors are respectively connected with the
control card through each shaft motion platform and an
actuator corresponding to a rotating device,
grating sensors are respectively arranged on the motion platform of an axle X and an axle Y and a direct
drive motor, and the
grating sensors are connected with the computer through an
encoder. The computer adopts the Windows
system to carry out the
modular design based on the VC++. The computer comprises a
data processing module, a
motion control module, a
control system initialization module, a
visual inspection locating module, a display interface module and a
laser cutting control module. By the technical scheme, the stable operation of the
software matching with the hardware of the whole control
system is achieved, the control
system organically integrates the tool device, the degree of the
automatic control is high, and the scribing efficiency is improved by 20% or so compared with the original scribing system.