The invention relates to a full-automatic 
wafer dicing saw 
control system based on vision. The full-automatic 
wafer dicing saw 
control system based on the vision is matched with a tool device, an optical 
maser and a micro-camera. Hardware comprises a computer, a 
motion control card and a displayer, wherein the 
control card, the displayer, the optical 
maser and the micro-camera are respectively connected with the computer, motors are respectively connected with the 
control card through each shaft motion platform and an 
actuator corresponding to a rotating device, 
grating sensors are respectively arranged on the motion platform of an axle X and an axle Y and a direct 
drive motor, and the 
grating sensors are connected with the computer through an 
encoder. The computer adopts the Windows 
system to carry out the 
modular design based on the VC++. The computer comprises a 
data processing module, a 
motion control module, a 
control system initialization module, a 
visual inspection locating module, a display interface module and a 
laser cutting control module. By the technical scheme, the stable operation of the 
software matching with the hardware of the whole control 
system is achieved, the control 
system organically integrates the tool device, the degree of the 
automatic control is high, and the scribing efficiency is improved by 20% or so compared with the original scribing system.