The invention relates to a full-automatic wafer dicing saw control system based on vision. The full-automatic wafer dicing saw control system based on the vision is matched with a tool device, an optical maser and a micro-camera. Hardware comprises a computer, a motion control card and a displayer, wherein the control card, the displayer, the optical maser and the micro-camera are respectively connected with the computer, motors are respectively connected with the control card through each shaft motion platform and an actuator corresponding to a rotating device, grating sensors are respectively arranged on the motion platform of an axle X and an axle Y and a direct drive motor, and the grating sensors are connected with the computer through an encoder. The computer adopts the Windows system to carry out the modular design based on the VC++. The computer comprises a data processing module, a motion control module, a control system initialization module, a visual inspection locating module, a display interface module and a laser cutting control module. By the technical scheme, the stable operation of the software matching with the hardware of the whole control system is achieved, the control system organically integrates the tool device, the degree of the automatic control is high, and the scribing efficiency is improved by 20% or so compared with the original scribing system.