Swelling and shrinking operation method of printed circuit board

Abstract

The invention discloses a swelling and shrinking method of a printed circuit board. The method comprises the following steps: drilling rate coefficient operation and outer image transferring operation. The swelling and the shrinking of the printed circuit board are abnormal after the printed circuit board is compressed, and the printed circuit board is operated according to an actual swelling and shrinking value, so that the degree of adaptability of a drilled hole and an inner layer is good; when the front swelling and shrinking of the outer layer of the printed circuit board are abnormal, a G / F direction region is separated from an non G / F direction region, the swelling and shrinking coefficient of the G / F direction is regulated, the regulated G / F direction region is combined with the non G / F direction region together, and the combined region is regulated according to the swelling and shrinking of the actual hole position of the printed circuit board, so that the problem of the alignment of drilled holes and the outer layer, and the problem of the G / F direction size are solved.

Description

technical field [0001] The invention belongs to the technical field of circuit boards, and in particular relates to an expansion and contraction commissioning method for printed circuit boards. Background technique [0002] In the prior art, the ultra-large liquid crystal (Liquid Crystal Display, liquid crystal display) PCB (Printed Circuit Board, printed circuit board) has very strict requirements on the size, and with the development of large-size wide-screen liquid crystal displays, the size of the LCD printed circuit board The length requirements are getting longer and longer, but the tolerance remains the same, and there is no way to ensure that the printed circuit boards have no abnormal expansion and shrinkage, and the existing methods for abnormal expansion and contraction boards lead to a large number of scrapped printed circuit boards and cannot meet the requirements. Customers require high-precision dimensions. At present, the dimensional tolerance of LCD printed ...

AI Technical Summary

Problems solved by technology

[0004] 1. If the drilling program is not commissioned or the commissioned adjustment ratio is small, it will cause the deviation between the drill hole and the inner layer, which will increase the inner PAD cut and the inner short scrap;

[0005] 2. The drilling program is commissioned according to the expansion and contraction value of the actual printed circuit board. The matching degree between the drilling and the inner layer is good, but the distance between the drilling holes after production is too different from the standard. The outer layer ratio must refer to Drilling and adjustment can ensure a good fit between the outer layer and the drilled hole, but after the outer layer is adjusted, the size will change accordingly, resulting in the size of the LCD panel in the G / F direction (that is, vertically downward or vertically upward) and T1 size will be abnormal

[0006] When commissioning work before the transfer of the outer layer image, the printed circuit board before the outer layer has abnormal expansion and contraction, and the outer layer magnification must be adjusted with reference to the drilled hole to ensure a good fit between the outer layer and the drilled hole, and to avoid the hole ring being cut and scrapped, but the outer layer After the layer magnification is adjusted, the corresponding G / F direction size and T1 size will be abnormal, resulting in abnormal size and scrapping