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An automatic leveling mechanism and a grinding and polishing machine

An automatic leveling and polishing machine technology, which is applied in the field of grinding and polishing machines, can solve the problems of product damage and uneven height, and achieve the effect of ensuring no damage

Active Publication Date: 2016-11-30
MORINAGA OPTICAL & ELECTRONICS EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] When the suspension part of the upper plate driven by the cylinder is lowered, the plate may be uneven during the landing process. After falling on the lower plate, part of it will be pressed on the product first, which may cause damage to the product.

Method used

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  • An automatic leveling mechanism and a grinding and polishing machine
  • An automatic leveling mechanism and a grinding and polishing machine
  • An automatic leveling mechanism and a grinding and polishing machine

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Embodiment Construction

[0016] Embodiments of the present invention will be further described below in conjunction with accompanying drawings:

[0017] Such as figure 1 , figure 2 with image 3 As shown, the present invention provides an automatic leveling mechanism, which is fixedly installed on the grinding and polishing machine through a horizontal mounting plate 5. The automatic leveling mechanism includes an induction device and a leveling device 1 for leveling the upper fixed plate , the leveling device is connected with the induction device, the leveling device is installed on the mounting plate 5, and is always in a horizontal state, the mounting plate is fixed on the cylinder of the grinding and polishing machine through a bracket, and is fixed on the cylinder of the grinding and polishing machine , because the cylinder of the grinding and polishing machine is always vertical, the horizontal state of the automatic leveling mechanism can be effectively guaranteed by vertically fixing the m...

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Abstract

The invention provides an automatic leveling mechanism and a grinding and polishing machine. The automatic leveling mechanism is mounted on the upper lapping plate pressing plate of the grinding and polishing machine. The automatic leveling mechanism comprises a drive device, a sensing device and a leveling device for leveling an upper lapping plate, wherein the drive device is respectively connected with the leveling device and the sensing device. The automatic leveling mechanism has the advantages that during descending and rotating of the upper lapping plate, the inclination of the upper lapping plate is sensed by the sensing device, the leveling device is controlled by the drive device to level the upper lapping plate, and the upper lapping plate is constantly kept a horizontal state during descending and operation.

Description

technical field [0001] The invention relates to an accessory for a grinding and polishing machine, in particular to an automatic leveling mechanism and a grinding and polishing machine using the mechanism. Background technique [0002] When the suspension part of the upper plate driven by the cylinder is lowered, the plate may be uneven during the landing process. After falling on the lower plate, part of it will be pressed on the product first, which may cause damage to the product. Contents of the invention [0003] In order to overcome the above technical deficiencies, the present invention provides an automatic leveling mechanism. [0004] The invention provides an automatic leveling mechanism, which is fixedly installed on a grinding and polishing machine through a horizontal mounting plate. The automatic leveling mechanism includes an induction device and a leveling device for leveling the upper fixed plate. The leveling The device is connected with the induction de...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/34
CPCB24B37/34
Inventor 石会会
Owner MORINAGA OPTICAL & ELECTRONICS EQUIP
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