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Electronic component embedded substrate and manufacturing method thereof

一种电子部件、基板的技术，应用在印刷电路制造、多层电路制造、电气元件等方向，能够解决制作过程复杂化、增加制造成本等问题

Inactive Publication Date: 2015-06-03
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, conventional printed circuit boards embedded with electronic components use tapes to fix the electronic components in the cavities, thereby increasing manufacturing costs and complicating the fabrication process due to the introduction of steps for attaching and detaching the tapes.

Method used

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  • Electronic component embedded substrate and manufacturing method thereof
  • Electronic component embedded substrate and manufacturing method thereof
  • Electronic component embedded substrate and manufacturing method thereof

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Embodiment Construction

[0023] Since various modifications and embodiments of the invention are possible, specific embodiments will be illustrated and described with reference to the drawings. However, this is by no means limiting the present invention to specific embodiments, but should be construed to include all modifications, equivalents, and replacements covered by the concept and scope of the present invention. Throughout the description of the present invention, when describing a certain technology is determined to avoid the gist of the present invention, the related detailed description will be omitted.

[0024] Terms such as 'first' and 'second' may be used in describing respective elements, however, the above elements should not be limited to the above terms. The above terms are only used to distinguish one element from another.

[0025] The terms used in this specification are intended to describe specific embodiments only, and in no way limit the present invention. Expressions in the si...

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Abstract

The present invention discloses an electronic component embedded substrate and a manufacturing method thereof. The electronic component embedded substrate in accordance with an embodiment of the present invention includes: a core board having a cavity formed therein; an electronic component being embedded in the cavity; and a circuit pattern formed on one surface of the core board and configured for fixing the electronic component in the cavity by pressing the electronic component.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of Korean Patent Application No. 10-2013-0146602 filed with the Korean Intellectual Property Office on Nov. 28, 2013, the entire contents of which are hereby incorporated by reference. technical field [0003] The present invention relates to a substrate embedding electronic components and a method of manufacturing a substrate embedding electronic components. Background technique [0004] As electronic products become smaller, there is an increasing demand for more integrated and thinner circuit boards mounted in these electronic products. In line with these demands, there has recently been an increasing need for printed circuit boards in which electronic components are embedded. [0005] A printed circuit board embedding electronic components is formed by an embedding process in which, after forming a cavity in a core board, electronic components are placed in the cavity and fixed ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/18H05K3/30H05K3/42
CPCH05K1/186H05K3/4673H05K2201/10393Y10T29/49139H05K3/46
Inventor 金凤守
Owner SAMSUNG ELECTRO MECHANICS CO LTD