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Manufacturing method of electronic device

A manufacturing method and technology of electronic equipment, applied in semiconductor/solid-state device manufacturing, circuits, electrical components, etc., can solve problems such as high liquid repellency, ink line width change, and line width narrowing

Inactive Publication Date: 2017-09-19
V TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

on the other hand, Figure 5 Among them, the liquid repellency of the substrate 21 to the ink 25 is high, so the ink 25 is not fixed but moves to the edge of the substrate, and the line width is also narrowed.
[0010] In this way, in the inkjet method, the line width of the ink changes due to the wettability of the substrate.

Method used

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  • Manufacturing method of electronic device
  • Manufacturing method of electronic device
  • Manufacturing method of electronic device

Examples

Experimental program
Comparison scheme
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Embodiment

[0058] Hereinafter, the present invention will be described more specifically based on examples, but the present invention is not limited by the following examples.

[0059] Make it in the following order figure 2 The electrode pattern structure of the electronic device shown.

[0060] First, PTFE having a surface energy lower than that of the glass substrate 1 was formed into a film with a thickness of 300 nm by spin coating (4000 rpm) on the cleaned glass substrate 1, and thermally cured at 150°C to form a base layer. 4 (surface energy: 8.7 mN / m).

[0061] Next, using an air curtain system laser CVD apparatus (manufactured by OMRON LASERFRONT Co., Ltd.), tungsten hexacarbonyl (W(CO) 6 ) and Ar as a purge gas while irradiating laser light (wavelength 349nm, width 5μm), decomposes into W and CO by photoreaction and thermal reaction, deposits tungsten film with the width of laser light, and forms the first layer 2 (surface energy: 30mN / m).

[0062] Then, on the upper surfa...

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Abstract

The present invention provides a method of manufacturing an electronic device having an electrode pattern that can be adjusted as needed, that can be formed with high precision and simply. A first layer (1) made of a material different from the substrate (1) and having a surface energy higher than that of the substrate (1) and an electrode pattern shape is formed on the substrate (1) by using an air curtain method laser CVD method A second layer (2) is formed on the upper surface of the first layer (1) by using conductive nano-ink, so as to form an electrode pattern of the electronic device.

Description

technical field [0001] The present invention relates to the formation of electrodes in electronic devices such as diodes and transistors. More specifically, the present invention relates to a method of manufacturing electronic devices having electrode patterns formed by a coating method. Background technique [0002] The miniaturization of electronic circuits is progressing year by year, and along with this, the finer wiring of electrodes is also progressing. Photolithography is generally used to fabricate such finely wired electrodes. [0003] However, in the lift-off or wet etching using the photolithography process, a large amount of solvents, chemicals, and electricity are used in resist coating, drying, exposure, development, and film etching, which affects the global environment. Come big loads. [0004] On the other hand, in recent years, electrode formation using printing has been performed as a method that requires the advantages of light equipment investment, mas...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/28C23C16/48H01L21/285H01L21/288
CPCC23C16/047C23C16/483H10K71/611
Inventor 水上诚奥慎也时任静士朱民徹铃木良和
Owner V TECH CO LTD