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Lead working mechanism, component supply device, component mounting apparatus and lead processing method

A technology of processing mechanism and processing method, applied in the direction of electrical components, electrical components, etc., can solve the problems of difficult electronic component circuit board installation, time-consuming, energy burden, etc.

Active Publication Date: 2015-11-04
JUKI CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in the component supply device and the component mounting device disclosed in Patent Document 1, for example, it is difficult to mount the above-mentioned radial lead type electronic components on the circuit board in a sideways manner.
Therefore, when mounting a radial lead type electronic component on a circuit board in a horizontal position, the operator bends the lead wire and inserts it into the through hole of the substrate, which takes a lot of time, effort, and burden on the operator.

Method used

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  • Lead working mechanism, component supply device, component mounting apparatus and lead processing method
  • Lead working mechanism, component supply device, component mounting apparatus and lead processing method
  • Lead working mechanism, component supply device, component mounting apparatus and lead processing method

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Embodiment Construction

[0084] Hereinafter, embodiments of a lead wire processing mechanism, a component supply device, a component mounting device, and a lead wire processing method according to the present invention will be described with reference to the drawings.

[0085] figure 1 It is a perspective view of the component mounting apparatus concerning this embodiment. figure 2 It is a schematic plan view showing a schematic configuration of a component supply unit of the component mounting device. image 3 It is a side view in which a part of a mounting head for mounting a component on a substrate by a suction nozzle is observed in section. Figure 4 It is a side view showing a schematic structure of the parts holding belt.

[0086] Such as figure 1 As shown, the component mounting device 10 according to this embodiment is a device for mounting electronic components (components) 31 described later on the substrate 11 . The component mounting apparatus 10 has a board transport unit 12 , a com...

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Abstract

The invention provides a lead working mechanism, a component supply device, a component mounting apparatus and a lead processing method. The mechanism is used for installing a unit in a radially leading manner to the substrate. The mechanism includes: a gripping portion (61), which clamp a plurality of leads (33) of an electronic component (31); and a lead bending portion (62), it is a pressing member main body (32) of the electronic means (31) towardsthe direction of the lead (33) is arranged in a direction orthogonal, wherein in the body member (32), the leads (33) is clamped to the clamping portion (61).

Description

technical field [0001] The present invention relates to a lead wire processing mechanism, a component supply device, a component mounting device and a lead wire processing method. Background technique [0002] A component mounting device that mounts electronic components on a circuit board, and a component supply device that supplies electronic components to the component mounting device are widely known. As an example of this component supply device, there is known a device of the type in which electronic component holding tapes holding electronic components held at fixed intervals on the holding tape main body are conveyed by a feeder unit, and moved to a component mounting device by a cutting unit. The lead wires of the electronic components in the suction region where the suction nozzle is suctioned are cut and separated (for example, refer to Patent Document 1). [0003] Patent Document 1: Japanese Unexamined Patent Publication No. 2013-65802 [0004] However, if it i...

Claims

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Application Information

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IPC IPC(8): H05K13/02H05K13/04B21F1/00
Inventor 阮山鹏
Owner JUKI CORP
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