Unlock instant, AI-driven research and patent intelligence for your innovation.

Die marking method and die marking equipment

A technology for labeling equipment and grains, applied in sorting, electrical components, circuits, etc., can solve the problems of difficulty in having a unified standard for grain damage, affecting the uniformity of grain selection, etc.

Active Publication Date: 2017-12-26
MPI CORP
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when whether the grain is damaged or not depends entirely on human judgment, it is difficult to have a unified standard for grain damage
Therefore, manual visual inspection seriously affects the uniformity of grain selection

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Die marking method and die marking equipment
  • Die marking method and die marking equipment
  • Die marking method and die marking equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] For the inconsistency of manual visual inspection, another automatic optical inspection and standard value filter can be used to determine whether the crystal grains on the sorting carrier are qualified. Specifically, a standard value filter can be used to compare whether the observation result of the automatic optical inspection for the crystal grain is within a preset standard value to determine whether the crystal grain is qualified. For example, it is possible to compare whether the damaged area of ​​the die is within a preset standard value to determine whether the die is qualified. Alternatively, it can be compared whether the thickness of the circuit on the die is within a preset standard value to determine whether the die is qualified. Unqualified crystal grains are defined as bad crystals, and a bad crystal map is established according to the location of the bad crystals. In the step of picking out bad crystals, the sorting carrier is overlapped with the corres...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a crystal grain marking method and crystal grain marking equipment, which are suitable for marking the positions of multiple crystal grains on a sorting carrier. The grain labeling method includes the following steps. The die map is displayed by the pixel array of the display device superimposed on the underside of the sorting carrier. The die map includes a background and a plurality of marked areas, the marked areas are distributed on the background corresponding to the preset positions of the dies, and each marked area is displayed by a plurality of pixels of the pixel array of the display device and surrounds the corresponding die. The vertical width of the marked area corresponding to the crystal grain judged to be damaged is greater than or equal to three times the vertical width of the pixels of the pixel array of the display device, and the horizontal width of the marked area corresponding to the grain is greater than or equal to that of the pixel array of the display device Three times the horizontal width in pixels. Therefore, the crystal grains judged to be damaged on the sorting carrier can be marked by marking the area.

Description

Technical field [0001] The invention relates to a crystal grain marking technology, in particular to a crystal grain marking method and a crystal grain marking device. Background technique [0002] The current common process applied to LED dies includes the following steps: probing, Automated Optical Inspection (AOI), sorting, manual visual inspection, and bad die picking. [0003] Spot testing refers to testing the photoelectric characteristics of the LED die. Automated optical inspection is to observe whether the appearance of the die is damaged through an automated optical inspection machine. Sorting is based on the results obtained by spot measurement and automated optical inspection, transferring good dies (ie, dies with low appearance damage) to a sorting carrier (sort page) according to optical characteristics, such as a viscous blue membrane. Manual visual inspection is to observe whether the appearance of all the crystal grains on the sorting carrier is damaged one by o...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B07C5/00H01L21/67
Inventor 蔡振扬廖惇材周明澔杨上毅陈维懋
Owner MPI CORP