Fan blade structure and cooling fan with same

Abstract

The invention relates to a fan blade structure and a cooling fan with the same. The fan blade structure comprises a hub and a guide body, wherein an extension part extends from the outer edge of the hub; the extension part is provided with a first side and a second side; an axial wire is defined at the axial center of the guide body; a cup joint part outwards extends from the axial wire; the cup joint part is connected with a turbulent flow part along the direction opposite to the axial wire; a plurality of holes are respectively formed in the axial and radial directions of the turbulent flow part; the guide body is arranged at one of the first side and the second side of the extension part of the hub; and the guide body is used for replacing a fan blade of the cooling fan, and the holes are used for forcibly guiding airflow, so that the whole thickness of the cooling fan can be greatly reduced.

Description

technical field [0001] The invention relates to a fan blade structure and a heat dissipation fan thereof, in particular to a fan blade structure and a heat dissipation fan which are thinner and still have better heat dissipation performance. Background technique [0002] With the thinning of various electronic devices and handheld devices, the storage space of the internal electronic components is also reduced. Although the storage space is reduced, the heat generated by the internal electronic components is getting hotter and hotter with the improvement of performance. Relatively, the heat dissipation elements and cooling fans used for heat dissipation also need to improve their heat dissipation performance. For handheld devices, in order to protect their internal electronic components, the accommodating space is extremely tight, and some handheld devices are not opened to communicate with the outside. The orifice, so it is quite difficult to dissipate heat. [0003] In or...

AI Technical Summary

Problems solved by technology

[0002] With the thinning of various electronic devices and handheld devices, the storage space of the internal electronic components is also reduced. Although the storage space is reduced, the heat generated by the internal electronic components is getting hotter and hotter with the improvement of performance. Relatively, the heat dissipation elements and cooling fans used for heat dissipation also need to improve their heat dissipation performance. For handheld devices, in order to protect their internal electronic components, the accommodating space is extremely tight, and some handheld devices are not opened to communicate with the outside. The orifice, so it is quite difficult to dissipate heat

[0003] In order to install a micro-fan in the narrow space inside the handheld device, another industry needs to reduce and thin the overall height of the fan. The first thing is to reduce the number of silicon steel sheets and coils in the fan stator structure and the number of fan blades. The height or blade area, but as the silicon steel sheets and coils decrease, it will affect the performance of the fan operation. If the height or blade area of ​​the fan blades is also reduced together, the cooling fan will not be able to exert its cooling performance

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