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Fan structure and electronic equipment

A technology for fans and fan components, which is applied in mechanical equipment, electrical digital data processing, non-variable-capacity pumps, etc., can solve problems such as friction, and achieve the effect of ensuring heat dissipation efficiency

Active Publication Date: 2022-08-05
LENOVO (BEIJING) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the embodiments of the present application is to provide a fan structure and electronic equipment, which can not only effectively solve the problem of friction between the blades of the fan assembly and the lower cover of the fan assembly due to the stress on the keyboard assembly, but also ensure the heat dissipation of the fan structure. Performance is not affected

Method used

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  • Fan structure and electronic equipment
  • Fan structure and electronic equipment

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Embodiment Construction

[0037] Various aspects and features of the present application are described herein with reference to the accompanying drawings.

[0038] It should be understood that various modifications may be made to the embodiments claimed herein. Therefore, the above description should not be regarded as limiting, but merely as exemplifications of embodiments. Those skilled in the art will envision other modifications within the scope and spirit of this application.

[0039] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the present application and, together with the general description of the application given above and the detailed description of the embodiments given below, serve to explain the advantages of the present application. principle.

[0040] These and other features of the present application will become apparent from the following description of preferred forms of embodiment, given as non-limiti...

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Abstract

The invention discloses a fan structure and electronic equipment. The fan structure comprises a fan assembly; the pressure detection assembly is used for determining the pressure borne by the fan assembly; and the driving assembly is electrically connected with the pressure detection assembly, the driving assembly is connected with the fan assembly, and based on the pressure determined by the pressure detection assembly, the fan assembly is driven to deform so as to ensure the heat dissipation efficiency of the fan structure. The pressure borne by the fan assembly is determined in real time through the pressure detection assembly, and the fan assembly is driven to deform in time through the driving assembly on the basis of the pressure, so that it is ensured that the heat dissipation efficiency of the fan structure is not affected by the pressure; the problem that the heat dissipation efficiency is reduced due to friction between the fan blades of the fan assembly and the lower cover plate of the fan assembly due to the fact that the keyboard assembly is stressed is effectively solved, and the purpose of ensuring the heat dissipation efficiency of the fan structure on the basis that the size of the fan blades is not changed is achieved.

Description

technical field [0001] The present application relates to the technical field of structures of electronic equipment, and in particular, to a fan structure and electronic equipment. Background technique [0002] As laptop designs get thinner and thinner, the gap between the laptop's fan and the keyboard is getting smaller and smaller. Usually, users tap the keyboard of the laptop to achieve typing and sending instructions. However, due to the different strengths of different users and the same user under different circumstances In a large situation (such as time urgency, user habits, etc.), at this time, a large tapping force may cause the gap between the fan and the keyboard to become smaller, and even cause the fan to move to the bottom case of the notebook computer. The fan blades rubbed against the lower cover of the fan and made noise, which caused the notebook computer to fail the factory test. [0003] At present, the above problems can be solved in the following two...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F04D27/00G06F1/20
CPCF04D27/00F04D27/001G06F1/203Y02D10/00
Inventor 刘晓阳
Owner LENOVO (BEIJING) CO LTD