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Bulb-type lighting apparatus

Technology of a lighting device and light bulb

Inactive Publication Date: 2015-11-25
SILICON WORKS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In other words, excessive thermal stress not only affects the luminous efficiency and life of the LED, but also affects the components mounted on the substrate.

Method used

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Embodiment Construction

[0031] Exemplary embodiments will be described in more detail below with reference to the accompanying drawings. However, this disclosure may be embodied in different forms and should not be construed as limited to only the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be complete and thorough, and will fully convey the scope of the disclosure to those skilled in the art. Throughout the present disclosure, like reference numerals refer to like parts in the drawings and examples.

[0032] A lighting device according to an embodiment of the present invention may be formed in a bulb shape and emit light using a semiconductor light emitting device. Typical embodiments of semiconductor light emitting devices may include LEDs. Therefore, a lighting device according to an embodiment of the present invention may use LEDs.

[0033] Refer to attached Figure 1-3 A light bulb-shaped lighting device according to an embodiment of the ...

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Abstract

Provided is a bulb-type lighting apparatus which uses an LED as a light source to improve a heat dissipation structure. The bulb-type lighting apparatus may include heat dissipation bodies in surface contact with a substrate having a semiconductor light emitting device mounted thereon, and dissipate heat of the substrate using the heat dissipation bodies.

Description

technical field [0001] The present invention relates to a lighting device, and more particularly, to a bulb-shaped lighting device using a light emitting diode (LED) as a light source to improve a heat dissipation structure. Background technique [0002] Recently, lighting devices using LEDs have been developed. An LED is an example of a semiconductor light emitting device, which utilizes the P-N junction of a semiconductor, and emits light through recombination between electrons in the N region and holes in the P region, which is generated by applying a forward voltage. [0003] LEDs generate heat while emitting light. Thermal stress caused by heat generation of the LED affects the substrate. That is to say, excessive thermal stress not only affects the luminous efficiency and lifespan of the LED, but also affects the components mounted on the substrate. [0004] Therefore, an illuminating device using LEDs as a light source needs to have an effective heat dissipation st...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S2/00F21V3/02F21V3/04F21V17/12F21V29/74F21V29/83F21Y101/02
CPCF21S2/00F21V3/02F21V3/04F21V17/12F21V29/74F21V29/83F21V3/06F21K9/232F21Y2115/10F21V17/10F21V29/67F21V29/717
Inventor 金容根
Owner SILICON WORKS CO LTD