Method and device for laser direct writing binary pattern at each speed range of scanning workbench

Abstract

The invention discloses a method and a device for directly writing a binary pattern by laser at each speed section of a scanning workbench. The binary image of a component to be processed in two-dimensional space is divided into mesh pixels of equal size, and each pixel is calculated. Corresponding exposure time and exposure intensity; plan the speed curve of the scanning table; determine the pixels in the acceleration section, constant speed section and deceleration section according to the speed curve and the size of the pixel point Dpp, and calculate the corresponding scanning line of each element to be processed The coordinate position of each pixel point; Compensate the exposure data corresponding to the pixel points whose boundaries are all or partly located in the acceleration section or deceleration section and the exposure intensity is not zero; make full use of the acceleration and deceleration sections of the scanning table for direct writing exposure In this way, on the premise of ensuring the quality of direct writing, the length of the non-exposure area of ​​the scanning table is compressed to the greatest extent, saving the direct writing time and improving the direct writing efficiency.

Description

technical field [0001] The invention relates to the technical field of laser direct writing, in particular to a method and a device for directly writing binary patterns by laser at each speed section of a scanning workbench. Background technique [0002] In order to use laser direct writing technology to process integrated circuit masks or optical elements with arbitrary patterns, the pattern to be processed is generally discretized in units of pixels, and then each pixel is subjected to variable dose exposure. Raster scanning point-by-point exposure based on a two-dimensional working platform is a mature direct writing technology commonly used. [0003] Literature [1] M.Haruna, S.Yoshida, H.Toda, and H.Nishihara, Laser-beam writing system for optical integrated circuits [J].Appl.Opt.26(21):4587-4592 introduced the Osaka University The laser direct writing equipment developed by M.Haruna et al. for processing optical integrated circuits, the processing method is direct writ...

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Problems solved by technology

[0007] It is not difficult to see from the above documents that the common feature of the above-mentioned laser direct writing equipment is that in order to obtain a uniform exposure effect, the scanning platform only performs exposure direct writing under the condition of uniform motion, and the acceleration section and deceleration section are not used, although this can avoid the exposure during the acceleration period. Distortion of light spots and changes in exposure caused by speed changes during direct writing in the deceleration section, but it also reduces direct writing efficiency

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