Method and device for all speed sections of scanning working platform to carry out laser direct writing of binary patterns

Abstract

The invention discloses a method and device for all the speed sections of a scanning working platform to carry out laser direct writing of binary patterns. The method comprises the following steps: segmenting the binary pattern of an element to be processed on a two-dimension space into equal-size meshed pixel points, and calculating the corresponding exposure time and exposure intensity of each pixel point; planning a speed curve of the scanning working platform; according to the speed curve and the size Dpp of the pixel points, determining the pixel points at an accelerating section, a constant-speed section and a decelerating section, and calculating coordinate positions of all the pixel points corresponding to each scanning line of the element to be processed; compensating exposure data corresponding to the pixel points of which the boundaries being wholly or partially positioned at the accelerating section or the decelerating section and the exposure intensity being not zero. The method and device disclosed by the invention have the beneficial effects that the accelerating section and the decelerating section of the scanning working platform are fully utilized for direct-writing exposure, so that on the premise of guaranteeing the direct-writing quality, the length of a non-exposure area of the scanning working platform is compressed to the greatest extent, and the direct-writing time is saved and the direct-writing efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of laser direct writing, in particular to a method and a device for directly writing binary patterns by laser at each speed section of a scanning workbench. Background technique [0002] In order to use laser direct writing technology to process integrated circuit masks or optical elements with arbitrary patterns, the pattern to be processed is generally discretized in units of pixels, and then each pixel is subjected to variable dose exposure. Raster scanning point-by-point exposure based on a two-dimensional working platform is a mature direct writing technology commonly used. [0003] Literature [1] M.Haruna, S.Yoshida, H.Toda, and H.Nishihara, Laser-beamwriting system for optical integrated circuits [J].Appl.Opt.26(21):4587-4592 introduced the development of M.Haruna of Osaka University in Japan, etc. The laser direct writing equipment used for processing optical integrated circuits, the processing meth...

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Problems solved by technology

[0007] It is not difficult to see from the above documents that the common feature of the above-mentioned laser direct writing equipment is that in order to obtain a uniform exposure effect, the scanning platform only performs exposure direct writing under the condition of uniform motion, and the acceleration section and deceleration section are not used, although this can avoid the exposure during the acceleration period. Distortion of light spots and changes in exposure caused by speed changes during direct writing in the deceleration section, but it also reduces direct writing efficiency

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